Agere Communications Inc.
9
Data Sheet
September 2001
L7585G Full-Feature, Low-Power SLIC and Switch
Operating States
(continued)
Ground Start/Tip Amplifier State
I
Current limiting is achieved by reducing ring lead
voltage only. This state is the same as Ground Start/
Tip Open, but with SW2 and SW2A closed and the
tip amplifier powered up.
I
Ring lead current limit is approximately the difference
of the high-current active state limit and the current
flowing out of the tip lead.
I
On-hook transmission not to exceed
–3 dBm with up
to 5 mA flowing out of the tip lead (maximum current
flow into the tip lead is permissible). Larger signal
and/or current may cause distortion.
I
NDET indicates an off-hook when the current flowing
out of the tip plus the current flowing into the ring is
twice the value programmed for the switchhook
detector.
Reverse Battery Ring Open State
I
Tip lead continuity test state (tone injected at the
receive port) in reverse battery.
I
Same as reverse battery active state, but with SW4
and SW4a open, and the ring drive amplifier
powered down.
I
Pin PR is high impedance (>100 k
).
I
Tip current limit is twice the low-current active state
current limit.
I
NDET indicates an off-hook when the tip current
(flowing into PT) is twice the value programmed for
the switchhook detector in the reverse battery active
state.
Reverse Battery Low-Current Active State
I
Normal talk and reverse battery feed state.
I
Same as forward battery active state, but PR is posi-
tive with respect to PT.
I
Current limit is lowered to approximately 0.66 times
the normal limit.
Absolute Maximum Ratings
(T
A
= 25 °C)
Stresses exceeding the values listed under absolute
maximum ratings may cause permanent damage to the
device. This is an absolute stress rating only. Func-
tional operation of the device at these or any other con-
ditions in excess of those indicated in the operational
sections of this data sheet is not implied. Exposure to
absolute maximum rating conditions for extended peri-
ods of time may adversely affect device reliability.
Note:
Analog voltages are referenced to AGND, digital (logic) volt-
ages are referenced to DGND, and battery voltages are ref-
erenced to BGND. The IC can be damaged unless all
ground connections are applied before and are removed
after all other connections. Furthermore, when powering the
device, the user must guarantee that no external potential
creates a voltage on any pin of the device that exceeds the
device ratings. Some of the known examples of conditions
that cause such potentials during powering are the following:
1) an inductor connected to tip and ring that can force an
overvoltage on V
BAT
through external components if the
V
BAT
connection chatters; and 2) inductance in the V
BAT
lead that could resonate with the V
BAT
filter capacitor to
cause a destructive overvoltage.
Parameter
Value
–0.5 to +7.0
Unit
V
+5 V dc Supplies (V
CCA
and
V
CCD
)
+10 V dc Bias Supply (V
SP
)
Office Battery Supply (V
BAT
)
Logic Input Voltage
–0.5 to +15
–63 to +0.5
–0.5 to
V
DDD
+ 0.5
±20
V
V
V
Logic Input Clamp Diode Cur-
rent, per Pin
Logic Output Voltage
mA
–0.5 to
V
DDD
+ 0.5
±35
V
Logic Output Current, per Pin
(excluding relay driver)
Operating Temperature Range
Storage Temperature Range
Relative Humidity Range
Ground Potential Difference
(BGND to AGND)
Ground Potential Difference
(DGND to AGND)
mA
–40 to +125
–40 to +125
5 to 95
±3
°C
°C
%RH
V
±3
V