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參數(shù)資料
| 型號： | LX1671CPW-TR |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 1 A SWITCHING CONTROLLER, 345 kHz SWITCHING FREQ-MAX, PDSO38 |
| 封裝： | ROHS COMPLIANT, PLASTIC, TSSOP-38 |
| 文件頁數(shù)： | 12/21頁 |
| 文件大?。?/td> | 419K |
| 代理商： | LX1671CPW-TR |
Microsemi
Integrated Products, Power Management
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2000
Rev. 1.2b, 2006-02-13
WWW
.Microse
m
i
.CO
M
LX1671
Multiple Output LoadSHARE PWM
PRODUCTION DATA SHEET
TM
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) DC................................................................-0.3V to 5.5V
Supply Voltage (VCC) Transient ......................................................-0.3V to 6.0V
Driver Supply Voltage (VC
x, V
CCL) DC ............................................-0.3V to 12V
Driver Supply Voltage (VC
x, V
CCL) Transient ...................................-0.3V to 14V
Linear Regulator Gate Drive, VLDGD ...................................................-0.3V to 9V
Current Sense Inputs (VSX, CSX) ....................................................... -0.3V to 12V
Error Amplifier Inputs (FBX, RF2, LDFB)........................................-0.3V to 5.5V
Input Voltage (SS/Enable, LDDIS) ...................................................-0.3V to5.5V
Output Drive Peak Current Source (HOx, LOx)....................................1A (500ns)
Output Drive Peak Current Sink (HOx, LOx) .......................................1A (500ns)
Operating Junction Temperature.................................................................. 150
°C
Storage Temperature Range...........................................................-65
°C to 150°C
RoHS Peak Package Solder Reflow Temperature
(40 second maximum exposure) ..................................................... 260°C (+0, -5)
Note:
Exceeding these ratings could cause damage to the device. All voltages are
with respect to Ground. Currents are positive into, negative out of specified
terminal.
The limitation on transient time is thermal and is due to zener diodes on the
supply pins, application of maximum voltages will increase current into that
pin and increase package power dissipation.
x = Denotes Phase 1, 2, or 3
TH ERMAL DATA
PW
Plastic TSSOP 38-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
85
°C/W
LQ
Plastic MLP 38-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
35
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The
θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
PACKAGE PIN OUT
1
19
38
20
LO1
PG1
LO2
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
RSVD
SS2
RF2
FB2
EO2
CS2
VS2
SS1
FB1
EO1
CS1
VS1
SS3
FB3
EO3
CS3
VS3
VCC
VCCL
PG3
LO3
HO3
VC3
VC1
H01
N.C.
N/U
PW PACKAGE
(Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
SS2
RF2
FB2
EO2
SS3
FB3
EO3
N.C.
CS3
VS3
N.C.
VCC
VCCL
PG3
HO3
VC
3
VC1
HO1
LO1
PG
1
LO2
CS
2
VS
2
SS
1
FB
1
EO
1
CS1
VS
1
RSVD
LO3
Connect
Bottom
to Power
GND
LQ PACKAGE
(Top View)
N.C. – No Internal Connection
N/U – Not Used
RSVD – Do Not Use
RoHS / Pb-free 100% Matte Tin Lead Finish
PP
AA
CC
KK
AA
GG
EE
DD
AA
TT
AA
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