參數(shù)資料
型號(hào): LX1673-03CPW-TR
廠商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類: 穩(wěn)壓器
英文描述: 1 A SWITCHING CONTROLLER, 345 kHz SWITCHING FREQ-MAX, PDSO20
封裝: ROHS COMPLIANT, PLASTIC, TSSOP-20
文件頁數(shù): 6/13頁
文件大?。?/td> 286K
代理商: LX1673-03CPW-TR
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2004
Rev 1.0, 3/18/2005
WWW
.Microse
m
i
.CO
M
LX1673
High Frequency PWM Regulator
PRODUCTION DATA SHEET
TM
ABSOLUTE MAXI MUM RATI NGS
Supply Voltage (VCC) DC................................................................-0.3V to 5.5V
Supply Voltage (VCC) Transient .........................................................-0.3V to 6V
Driver Supply Voltage (VCCL) DC .....................................................-0.3V to 13V
Driver Supply Voltage (VCCL) Transient............................................-0.3V to 16V
Driver Supply Voltage (VC1) DC .......................................................-0.3V to 19V
Input Voltage (SS/DIS) .....................................................................-0.3V to 5.5V
Output Drive Peak Current Source (HO, LO).......................................1A (500ns)
Output Drive Peak Current Sink (HO, LO) ..........................................1A (500ns)
Operating Temperature Range .........................................................-40°C to 85°C
Maximum Operating Junction Temperature ................................................ 150°C
Storage Temperature Range...........................................................-65°C to 150°C
Lead Temperature (Soldering 180 seconds) ................................................ 235°C
Package Peak Temp. for Solder Reflow (40 Seconds Maximum Exposure).. 260°C(+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
The limitation on transient time is thermal and is due to zener diodes on the supply
pins, application of maximum voltages will increase current into that pin and
increase package power dissipation.
TH ERM A L DATA
PW
Plastic TSSOP 20-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θJA
90
°C/W
LQ
Plastic MLPQ 20-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
35°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no airflow.
PACKAGE PIN OUT
LDGD
LDFB
LDDIS
DGND
AGND
CS
VS
VCC
VCCL
BDRV
PG
N
D
TD
R
V
VC
1
PWG
D
LD
V
C
EAO
EA-
EA+
SS
DIS
1
6
11
16
LQ PACKAGE
(Top View)
N.C. – No Internal Connection
N/U – Not Used
RSVD – Do Not Use
VC1
PGOOD
LDOVCC
LDGD
LDFB
LDDIS
DGND
AGND
EAO
CS
VS
VCC
VCCL
BDRV
PGND
TDRV
1
10
11
20
DIS
SS
EA+
EA-
PW PACKAGE
(Top View)
Pb-free 100% Matte Tin Lead Finish
PP
AA
CC
KK
AA
GG
EE
DD
AA
TT
AA
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