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參數(shù)資料
| 型號(hào)： | LX1741CDU-TR |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 0.145 A SWITCHING CONTROLLER, PDSO8 |
| 封裝： | PLASTIC, MSOP-8 |
| 文件頁數(shù)： | 8/15頁 |
| 文件大小： | 479K |
| 代理商： | LX1741CDU-TR |
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2000
Rev. 1.1b, 2005-03-03
WWW
.Microse
m
i
.CO
M
LX1741
High Efficiency High Voltage Boost Controller
PRODUCTION DATA SHEET
I N T E GRA T ED
PR ODUC T S
ABSOLUTE MAXI MUM RATI NGS
Supply Voltage (VCC) .................................................................................... -0.3V to 7.0V
Feedback Input Voltage (VFB) ..............................................................-0.3V to VIN + 0.3V
Shutdown Input Voltage (VSHDN) ........................................................-0.3V to VIN + 0.3V
PWM Input Amplitude .........................................................................-0.3V to VIN + 0.3V
Analog Adjust Input Voltage (VADJ).................................................................-0.3V to VIN
Source Input Current (ISRC).................................................................................. 0.80 ARMS
Operating Junction Temperature................................................................................ 150°C
Storage Temperature Range.........................................................................-65°C to 150°C
Lead Temperature (Soldering 180 seconds)............................................................... 235°C
Peak Package Solder Reflow Temp. (40 seconds max. exposure) ................ 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
TH ERM A L DATA
DU
Plastic MSOP 8-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θJA
206
°C/W
THERMAL RESISTANCE
-JUNCTION TO CASE,
θJC
39
°C/W
LM
Plastic MLP 8-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θJA
41
°C/W
THERMAL RESISTANCE
-JUNCTION TO CASE,
θJC
5.2
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
PACKAGE PIN OUT
1
2
4
3
5
6
8
7
SRC
CS
GND
IN
NDRV
FB
ADJ
SHDN
DU PACKAGE
(Top View)
4
3
2
1
5
6
7
8
SRC
CS
GND
SHDN
NDRV
FB
IN
ADJ
LM PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
FUNCTIONAL PIN DESCRIPTION
NAME
DESCRIPTION
IN
Unregulated IC Supply Voltage Input – Input range from +1.6V to 6.0V. Bypass with a 1F or greater capacitor
for operation below 2.0V.
FB
Feedback Input – Connect to a resistive divider network between the output and GND to set the voltage at VFB
(see Output Voltage Programming: Application Information).
SHDN
Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to 0.1A.
Connect SHDN to VCC for normal operation.
NDRV
MOSFET Gate Driver – Connects to an external N-Channel MOSFET.
CS
Current-Sense Amplifier Input – Connecting a resistor between CS and GND sets the peak inductor current limit.
GND
Common terminal for ground reference.
ADJ
An applied PWM Signal Input becomes the internal reference, via an internal filter and gain resistor, thus allowing
for a dynamic output voltage adjustment of ±15% (i.e., corresponding to the duty cycle variance). Connecting this
pin to ground causes the device to revert to the internal voltage reference (note: refer to figure 8).
SRC
MOSFET Current Sense Input - Connects to the External N-Channel MOSFET Source.
PP
AA
CC
KK
AA
GG
EE
DD
AA
TT
AA
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