Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2000
Rev. 1.1, 2002-11-21
W
M
.
C
LX1741
High Efficiency High Voltage Boost Controller
P
RODUCTION
D
ATA
S
HEET
I N T E G R A T E D P R O D U C T S
A B S O L U T E M A X I M U M R A T I N G S
Supply Voltage (V
CC
).....................................................................................-0.3V to 7.0V
Feedback Input Voltage (V
FB
).............................................................. -0.3V to V
IN
+ 0.3V
Shutdown Input Voltage (V
SHDN
)........................................................ -0.3V to V
IN
+ 0.3V
PWM Input Amplitude......................................................................... -0.3V to V
IN
+ 0.3V
Analog Adjust Input Voltage (V
ADJ
)................................................................ -0.3V to V
IN
Source Input Current (I
SRC
)..................................................................................0.80 A
RMS
Operating Junction Temperature................................................................................150
C
Storage Temperature Range........................................................................ -65
°
C to 150
°
C
Lead Temperature (Soldering 180 seconds)...............................................................235
°
C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
T H E R M A L D A T A
DU
Plastic MSOP 8-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
THERMAL RESISTANCE
-
JUNCTION TO
C
ASE
,
θ
JC
206
°
C/W
39
°
C/W
LM
Plastic MLP 8-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
THERMAL RESISTANCE
-
JUNCTION TO
C
ASE
,
θ
JC
41
°
C/W
5.2
°
C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JC
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
P A C K A G E P IN O U T
1
2
4
3
5
6
8
7
SRC
CS
GND
IN
NDRV
FB
ADJ
SHDN
DU P
ACKAGE
(Top View)
4
3
2
1
5
6
7
8
SRC
CS
GND
SHDN
NDRV
FB
IN
ADJ
LM P
ACKAGE
(Top View)
F U N C T I O N A L P I N D E S C R I P T I O N
N
AME
D
ESCRIPTION
IN
Unregulated IC Supply Voltage Input – Input range from +1.6V to 6.0V. Bypass with a 1
μ
F or greater capacitor
for operation below 2.0V.
Feedback Input – Connect to a resistive divider network between the output and GND to set the voltage at V
FB
(see Output Voltage Programming: Application Information).
Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to 0.1
μ
A.
Connect
SHDN
to V
CC
for normal operation.
FB
SHDN
NDRV
MOSFET Gate Driver – Connects to an external N-Channel MOSFET.
CS
Current-Sense Amplifier Input – Connecting a resistor between CS and GND sets the peak inductor current limit.
GND
Common terminal for ground reference.
ADJ
An applied PWM Signal Input becomes the internal reference, via an internal filter and gain resistor, thus allowing
for a dynamic output voltage adjustment of
±
15% (i.e., corresponding to the duty cycle variance). Connecting this
pin to ground causes the device to revert to the internal voltage reference (note: refer to figure 8).
SRC
MOSFET Current Sense Input - Connects to the External N-Channel MOSFET Source.
P
A
C
K
A
G
E
D
A
T
A