參數(shù)資料
型號(hào): LX8384B-33CP
廠商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: 5A LOW DROPOUT POSITIVE REGULATORS
中文描述: 3.3 V FIXED POSITIVE LDO REGULATOR, 1.3 V DROPOUT, PSFM3
封裝: ROHS COMPLIANT, PLASTIC, TO-220, 3 PIN
文件頁(yè)數(shù): 2/8頁(yè)
文件大小: 216K
代理商: LX8384B-33CP
5A L
OW
D
ROPOUT
P
OSITIVE
R
E G U L AT O R S
LX8384-xx/8384A-xx/8384B-xx
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 1997
Rev. 1.9 12/97
2
P
R O D U C T I O N
D
A T A
S
H E E T
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Power Dissipation ..................................................................................Internally Limited
Input Voltage................................................................................................................ 10V
Input to Output Voltage Differential........................................................................... 10V
Operating Junction Temperature
Hermetic (K - Package) ........................................................................................ 150°C
Plastic (DD - Package).......................................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds)............................................................. 300°C
PACKAGE PIN OUTS
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified terminal.
V
IN
V
OUT
ADJ / GND*
3
2
1
P PACKAGE
(Top View)
* Pin 1 is GND for fixed voltage versions.
3
2
1
V
IN
V
OUT
ADJ / GND*
DD PACKAGE
(Top View)
* Pin 1 is GND for fixed voltage versions.
BLOCK DIAGRAM
Thermal
Limit Circuit
Control
Circuit
Bandgap
Circuit
Output
Circuit
Bias
Circuit
V
OUT
V
IN
SOA Protection
Circuit
Current
Limit Circuit
ADJ or
GND*
P PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB,
θ
JT
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DD PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB,
θ
JT
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
*
θ
can be improved with package soldered to 0.5IN
2
copper area over backside ground
plane or internal power plane.
θ
JA
can vary from 20oC/W to > 40oC/W depending on
mounting technique.
2.7°C/W
60°C/W
2.7°C/W
60°C/W*
THERMAL DATA
TAB IS V
OUT
TAB IS V
OUT
* This pin GND for fixed voltage versions.
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