參數(shù)資料
型號: M1A3P400-FGG144II
元件分類: FPGA
英文描述: FPGA, 9216 CLBS, 400000 GATES, 350 MHz, PBGA144
封裝: 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
文件頁數(shù): 45/49頁
文件大小: 5893K
代理商: M1A3P400-FGG144II
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examples explain typical applications of the products, and do not guarantee the success of any specific
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相關PDF資料
PDF描述
M1A3P400-FGG256II FPGA, 9216 CLBS, 400000 GATES, 350 MHz, PBGA256
M1A3P400-FGG484II FPGA, 9216 CLBS, 400000 GATES, 350 MHz, PBGA484
M1A3P400-PQ208II FPGA, 9216 CLBS, 400000 GATES, 350 MHz, PQFP208
M1A3P400-PQG208II FPGA, 9216 CLBS, 400000 GATES, 350 MHz, PQFP208
M1A3P600-1FG144I FPGA, 13824 CLBS, 600000 GATES, PBGA144
相關代理商/技術參數(shù)
參數(shù)描述
M1A3P400-FGG144PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
M1A3P400-FGG256 功能描述:IC FPGA 1KB FLASH 400K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
M1A3P400-FGG256I 功能描述:IC FPGA 1KB FLASH 400K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
M1A3P400-FGG484 功能描述:IC FPGA 1KB FLASH 400K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
M1A3P400-FGG484I 功能描述:IC FPGA 1KB FLASH 400K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)