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參數(shù)資料
| 型號(hào)： | M1A3P600-FG256 |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 13824 CLBS, 600000 GATES, 350 MHz, PBGA256 |
| 封裝： | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 |
| 文件頁(yè)數(shù)： | 35/218頁(yè) |
| 文件大小： | 6270K |
| 代理商： | M1A3P600-FG256 |
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ProASIC3 Device Family Overview
v1.3
1 - 9
51700097-001-0
(continued)
In the "ProASIC3 Ordering Information", the QN package measurements were
updated to include both 0.4 mm and 0.5 mm.
In the "General Description" section, the number of I/Os was updated from 288
to 300.
v2.2
(July 2007)
This document was previously in datasheet v2.2. As a result of moving to the
handbook format, Actel has restarted the version numbers. The new version
number is 51700097-001-0.
N/A
v2.1
(May 2007)
The M7 and M1 device part numbers have been updated in Table 1 ProASIC3
Product
Family,
"I/Os
Per
Package",
"Automotive
ProASIC3
Ordering
Information", "Temperature Grade Offerings", and "Speed Grade and
Temperature Grade Matrix".
i, ii, iii,
iii, iv
The words "ambient temperature" were added to the temperature range in
the "Automotive ProASIC3 Ordering Information", "Temperature Grade
Offerings", and "Speed Grade and Temperature Grade Matrix" sections.
iii, iv
v2.0
(April 2007)
In the "Clock Conditioning Circuit (CCC) and PLL" section, the Wide Input
Frequency Range (1.5 MHz to 200 MHz) was changed to (1.5 MHz to 350 MHz).
i
The "Clock Conditioning Circuit (CCC) and PLL" section was updated.
i
In the "I/Os Per Package" section, the A3P030, A3P060, A3P125, ACP250, and
A3P600 device I/Os were updated.
ii
Advance v0.7
(January 2007)
In the "Packaging Tables", Ambient was deleted.
ii
Ambient was deleted from the "Speed Grade and Temperature Grade Matrix".
iv
Advance v0.6
(April 2006)
In the "I/Os Per Package" table, the I/O numbers were added for A3P060,
A3P125, and A3P250. The A3P030-VQ100 I/O was changed from 79 to 77.
ii
Advance v0.5
(January 2006)
B-LVDS and M-LDVS are new I/O standards added to the datasheet.
N/A
The term flow-through was changed to pass-through.
N/A
Table 1 was updated to include the QN132.
ii
The "I/Os Per Package" table was updated with the QN132. The footnotes were
also updated. The A3P400-FG144 I/O count was updated.
ii
"Automotive ProASIC3 Ordering Information" was updated with the QN132.
iii
"Temperature Grade Offerings" was updated with the QN132.
iii
Advance v0.4
(November 2005)
The "I/Os Per Package" table was updated for the following devices and
packages:
Device
Package
A3P250/M7ACP250
VQ100
A3P250/M7ACP250
FG144
A3P1000
FG256
ii
Advance v0.3
M7 device information is new.
N/A
The I/O counts in the "I/Os Per Package" table were updated.
ii
Advance v0.2
The "I/Os Per Package" table was updated.
ii
Previous Version
Changes in Current Version (v1.3)
Page
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| M1A3P600-FG484I | FPGA, 13824 CLBS, 600000 GATES, PBGA484 |
| M1A3P600-FG484 | FPGA, 13824 CLBS, 600000 GATES, 350 MHz, PBGA484 |
| M1A3P600-FGG144I | FPGA, 13824 CLBS, 600000 GATES, PBGA144 |
| M1A3P600-FGG144 | FPGA, 13824 CLBS, 600000 GATES, 350 MHz, PBGA144 |
| M1A3P600-FGG256I | FPGA, 13824 CLBS, 600000 GATES, PBGA256 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M1A3P600-FG256I | 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| M1A3P600-FG484 | 功能描述:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| M1A3P600-FG484I | 功能描述:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27） |
| M1A3P600-FGG144 | 功能描述:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| M1A3P600-FGG144ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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