2-18 Revision 13 Summary of I/O Timing Characteristics – Default I/O Software Settings
參數(shù)資料
型號: M1A3PE1500-1FGG484
廠商: Microsemi SoC
文件頁數(shù): 89/162頁
文件大小: 0K
描述: IC FPGA 1KB FLASH 1.5M 484-FBGA
標(biāo)準(zhǔn)包裝: 40
系列: ProASIC3E
RAM 位總計(jì): 276480
輸入/輸出數(shù): 280
門數(shù): 1500000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FPBGA(23x23)
ProASIC3E DC and Switching Characteristics
2-18
Revision 13
Summary of I/O Timing Characteristics – Default I/O Software
Settings
Table 2-15 Summary of AC Measuring Points
Standard
Input Reference Voltage
(VREF_TYP)
Board Termination
Voltage (VTT_REF)
Measuring Trip Point
(Vtrip)
3.3 V LVTTL / 3.3 V
LVCMOS
1.4 V
3.3 V LVCMOS Wide Range
1.4 V
2.5 V LVCMOS
1.2 V
1.8 V LVCMOS
0.90 V
1.5 V LVCMOS
0.75 V
3.3 V PCI
0.285 * VCCI (RR)
0.615 * VCCI (FF))
3.3 V PCI-X
0.285 * VCCI (RR)
0.615 * VCCI (FF)
3.3 V GTL
0.8 V
1.2 V
VREF
2.5 V GTL
0.8 V
1.2 V
VREF
3.3 V GTL+
1.0 V
1.5 V
VREF
2.5 V GTL+
1.0 V
1.5 V
VREF
HSTL (I)
0.75 V
VREF
HSTL (II)
0.75 V
VREF
SSTL2 (I)
1.25 V
VREF
SSTL2 (II)
1.25 V
VREF
SSTL3 (I)
1.5 V
1.485 V
VREF
SSTL3 (II)
1.5 V
1.485 V
VREF
LVDS
Cross point
LVPECL
Cross point
Table 2-16 I/O AC Parameter Definitions
Parameter
Definition
tDP
Data to Pad delay through the Output Buffer
tPY
Pad to Data delay through the Input Buffer with Schmitt trigger disabled
tDOUT
Data to Output Buffer delay through the I/O interface
tEOUT
Enable to Output Buffer Tristate Control delay through the I/O interface
tDIN
Input Buffer to Data delay through the I/O interface
tPYS
Pad to Data delay through the Input Buffer with Schmitt trigger enabled
tHZ
Enable to Pad delay through the Output Buffer—High to Z
tZH
Enable to Pad delay through the Output Buffer—Z to High
tLZ
Enable to Pad delay through the Output Buffer—Low to Z
tZL
Enable to Pad delay through the Output Buffer—Z to Low
tZHS
Enable to Pad delay through the Output Buffer with delayed enable—Z to High
tZLS
Enable to Pad delay through the Output Buffer with delayed enable—Z to Low
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