Revision 13 1-3 Advanced Architecture The proprietary ProASIC3E architecture provides granularity comparable to stand" />
參數(shù)資料
型號: M1A3PE3000-1FG324
廠商: Microsemi SoC
文件頁數(shù): 152/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 324-FBGA
標準包裝: 84
系列: ProASIC3E
RAM 位總計: 516096
輸入/輸出數(shù): 221
門數(shù): 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 324-BGA
供應(yīng)商設(shè)備封裝: 324-FBGA(19x19)
ProASIC3E Flash Family FPGAs
Revision 13
1-3
Advanced Architecture
The proprietary ProASIC3E architecture provides granularity comparable to standard-cell ASICs. The
ProASIC3E device consists of five distinct and programmable architectural features (Figure 1-1 on
FPGA VersaTiles
Dedicated FlashROM
Dedicated SRAM/FIFO memory
Extensive CCCs and PLLs
Pro I/O structure
The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input logic
function, a D-flip-flop (with or without enable), or a latch by programming the appropriate flash switch
interconnections. The versatility of the ProASIC3E core tile as either a three-input lookup table (LUT)
equivalent or as a D-flip-flop/latch with enable allows for efficient use of the FPGA fabric. The VersaTile
capability is unique to the ProASIC family of third-generation architecture Flash FPGAs. VersaTiles are
connected with any of the four levels of routing hierarchy. Flash switches are distributed throughout the
device to provide nonvolatile, reconfigurable interconnect programming. Maximum core utilization is
possible for virtually any design.
Figure 1-1 ProASIC3E Device Architecture Overview
4,608-Bit Dual-Port SRAM
or FIFO Block
VersaTile
RAM Block
CCC
Pro I/Os
ISP AES Decryption
User Nonvolatile
FlashROM
Charge Pumps
4,608-Bit Dual-Port SRAM
or FIFO Block
RAM Block
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3PE3000-1FG324I 功能描述:IC FPGA 1KB FLASH 3M 324-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1A3PE3000-1FG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
M1A3PE3000-1FG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1A3PE3000-1FG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
M1A3PE3000-1FG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs