參數(shù)資料
型號: M1A3PE3000-FGG896I
廠商: Microsemi SoC
文件頁數(shù): 1/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
標(biāo)準(zhǔn)包裝: 27
系列: ProASIC3E
RAM 位總計: 516096
輸入/輸出數(shù): 620
門數(shù): 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 896-BGA
供應(yīng)商設(shè)備封裝: 896-FBGA(31x31)
January 2013
I
2013 Microsemi Corporation
ProASIC3E Flash Family FPGAs
with Optional Soft ARM Support
Features and Benefits
High Capacity
600 k to 3 Million System Gates
108 to 504 kbits of True Dual-Port SRAM
Up to 620 User I/Os
Reprogrammable Flash Technology
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
Instant On Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
On-Chip User Nonvolatile Memory
1 kbit of FlashROM with Synchronous Interfacing
High Performance
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI
In-System Programming (ISP) and Security
ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
FlashLock Designed to Secure FPGA Contents
Low Power
Core Voltage for Low Power
Support for 1.5-V-Only Systems
Low-Impedance Flash Switches
High-Performance Routing Hierarchy
Segmented, Hierarchical Routing and Clock Structure
Ultra-Fast Local and Long-Line Network
Enhanced High-Speed, Very-Long-Line Network
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
Pro (Professional) I/O
700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—up to 8 Banks per Chip
Single-Ended
I/O
Standards:
LVTTL,
LVCMOS
3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS
2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
Schmitt Trigger Option on Single-Ended Inputs
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the ProASIC3E Family
Clock Conditioning Circuit (CCC) and PLL
Six CCC Blocks, Each with an Integrated PLL
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities
and External Feedback
Wide Input Frequency Range (1.5 MHz to 350 MHz)
SRAMs and FIFOs
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
True Dual-Port SRAM (except ×18)
24 SRAM and FIFO Configurations with Synchronous Operation
up to 350 MHz
ARM Processor Support in ProASIC3E FPGAs
M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available
with or without Debug
Table 1-1 ProASIC3E Product Family
ProASIC3E Devices
A3PE600
A3PE1500
A3PE3000
Cortex-M1 Devices 1
M1A3PE1500
M1A3PE3000
System Gates
600,000
1,500,000
3,000,000
VersaTiles (D-flip-flops)
13,824
38,400
75,264
RAM Kbits (1,024 bits)
108
270
504
4,608-Bit Blocks
24
60
112
FlashROM Kbits
11
1
Secure (AES) ISP
Yes
CCCs with Integrated PLLs2
66
6
VersaNet Globals3
18
I/O Banks
88
8
Maximum User I/Os
270
444
620
Package Pins
PQFP
FBGA
PQ208
FG256, FG484
PQ208
FG484, FG676
PQ208
FG324
, FG484, FG896
Notes:
1. Refer to the Cortex-M1 product brief for more information.
2. The PQ208 package supports six CCCs and two PLLs.
3. Six chip (main) and three quadrant global networks are available.
4. For devices supporting lower densities, refer to the ProASIC3 Flash Family FPGAs datasheet.
Revision 13
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