II Revision 13 I/Os Per Package1 ProASIC3E Device Status ProASIC3E Dev" />
參數(shù)資料
型號: M1A3PE3000L-FGG484
廠商: Microsemi SoC
文件頁數(shù): 75/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 484-FBGA
標準包裝: 40
系列: ProASIC3EL
RAM 位總計: 516096
輸入/輸出數(shù): 341
門數(shù): 3000000
電源電壓: 1.14V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 484-BGA
供應商設備封裝: 484-FPBGA(23x23)
ProASIC3E Flash Family FPGAs
II
Revision 13
I/Os Per Package1
ProASIC3E Device Status
ProASIC3E Devices
A3PE600
A3PE1500 3
A3PE3000 3
Cortex-M1 Devices 2
M1A3PE1500
M1A3PE3000
Package
I/O Types
Sin
g
le
-E
nd
ed
I/
O
1
Differen
tial
I/
O
Pai
rs
Sin
g
le
-E
nd
ed
I/
O
1
Differen
tial
I/
O
Pai
rs
Sin
g
le
-E
nd
ed
I/
O
1
Differen
tial
I/
O
Pai
rs
PQ208
147
65
147
65
147
65
FG256
165
79
––––
FG324
––––
221
110
FG484
270
135
280
139
341
168
FG676
444
222
FG896
––––
620
310
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to the ProASIC3E FPGA Fabric User’s
Guide to ensure compliance with design and board migration requirements.
2. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
3. For A3PE1500 and A3PE3000 devices, the usage of certain I/O standards is limited as follows:
– SSTL3(I) and (II): up to 40 I/Os per north or south bank
– LVPECL / GTL+ 3.3 V / GTL 3.3 V: up to 48 I/Os per north or south bank
– SSTL2(I) and (II) / GTL+ 2.5 V/ GTL 2.5 V: up to 72 I/Os per north or south bank
4. FG256 and FG484 are footprint-compatible packages.
5. When using voltage-referenced I/O standards, one I/O pin should be assigned as a voltage-referenced pin (VREF) per
minibank (group of I/Os).
6. "G" indicates RoHS-compliant packages. Refer to the "ProASIC3E Ordering Information" on page III for the location of the "G"
in the part number.
Table 1-2 ProASIC3E FPGAs Package Sizes Dimensions
Package
PQ208
FG256
FG324
FG484
FG676
FG896
Length × Width (mm\mm)
28 × 28
17 × 17
19 × 19
23 × 23
27 × 27
31 × 31
Nominal Area (mm2)
784
289
361
529
729
961
Pitch (mm)
0.5
1.0
Height (mm)
3.40
1.60
1.63
2.23
ProASIC3E Devices
Status
M1 ProASIC3E Devices
Status
A3PE600
Production
A3PE1500
Production
M1A3PE1500
Production
A3PE3000
Production
M1A3PE3000
Production
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相關代理商/技術參數(shù)
參數(shù)描述
M1A3PE3000L-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3EL 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
M1A3PE3000L-FGG484M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 341 I/O 484FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 484FBGA
M1A3PE3000L-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3EL 產品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA(23x23)
M1A3PE3000L-FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3EL 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
M1A3PE3000L-FGG896M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 896FBGA