3-4 Revision 13 Special Function Pins NC No Connect This pin is not connected to circuitry within the device. These" />
參數(shù)資料
型號： M1A3PE3000L-FGG484I
廠商： Microsemi SoC
文件頁數(shù)： 3/162頁
文件大?。?/td> 0K
描述： IC FPGA 1KB FLASH 3M 484-FBGA
標準包裝： 40
系列： ProASIC3EL
RAM 位總計： 516096
輸入/輸出數(shù)： 341
門數(shù)： 3000000
電源電壓： 1.14V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 484-BGA
供應商設備封裝： 484-FPBGA（23x23）
Pin Descriptions and Packaging
3-4
Revision 13
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
User’s Guides
Packaging
The following documents provide packaging information and device selection for low power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
相關PDF資料
PDF描述
ACB85DHNT CONN EDGECARD 170PS .050 DIP SLD
ABB85DHNT CONN EDGECARD 170PS .050 DIP SLD
180-015-173L030 CONN DB15 MALE HD CRIMP NICKEL
170-050-272-030 CONN DB50 CRIMP FEMALE TIN
ACB85DHHT CONN EDGECARD 170PS .050 DIP SLD
相關代理商/技術參數(shù)
參數(shù)描述
M1A3PE3000L-FGG484M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 341 I/O 484FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 484FBGA
M1A3PE3000L-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3EL 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
M1A3PE3000L-FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3EL 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設備封裝:352-CQFP（75x75）
M1A3PE3000L-FGG896M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 896FBGA
M1A3PE3000L-PQ144M 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:Military ProASIC3/EL Low-Power Flash FPGAs
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