II Revision 13 I/Os Per Package 1 IGLOOe FPGAs Package Sizes Dimension" />
參數(shù)資料
型號: M1AGLE3000V2-FGG484
廠商: Microsemi SoC
文件頁數(shù): 79/166頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 484-FBGA
標(biāo)準(zhǔn)包裝: 60
系列: IGLOOe
邏輯元件/單元數(shù): 75264
RAM 位總計: 516096
輸入/輸出數(shù): 341
門數(shù): 3000000
電源電壓: 1.14 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FPBGA(23x23)
IGLOOe Low Power Flash FPGAs
II
Revision 13
I/Os Per Package 1
IGLOOe FPGAs Package Sizes Dimensions
IGLOOe Device Status
IGLOOe Devices
AGLE600
AGLE3000
ARM-Enabled IGLOOe Devices
M1AGLE3000
Package
I/O Types
Single-Ended
I/O1
Differential
I/O Pairs
Single-Ended
I/O1
Differential
I/O Pairs
FG256
165
79
FG484
270
135
341
168
FG896
620
310
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to the IGLOOe FPGA Fabric User’s Guide to
ensure compliance with design and board migration requirements.
2. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
3. For AGLE3000 devices, the usage of certain I/O standards is limited as follows:
– SSTL3(I) and (II): up to 40 I/Os per north or south bank
– LVPECL / GTL+ 3.3 V / GTL 3.3 V: up to 48 I/Os per north or south bank
– SSTL2(I) and (II) / GTL+ 2.5 V/ GTL 2.5 V: up to 72 I/Os per north or south bank
4. FG256 and FG484 are footprint-compatible packages.
5. When using voltage-referenced I/O standards, one I/O pin should be assigned as a voltage-referenced pin (VREF) per
minibank (group of I/Os).
6. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not as a regular I/O, the number of single-ended
user I/Os available is reduced by one.
7. "G" indicates RoHS-compliant packages. Refer to "IGLOOe Ordering Information" on page III for the location of the "G" in the
part number.
Package
FG256
FG484
FG896
Length × Width (mm × mm)
17 × 17
23 × 23
31 × 31
Nominal Area (mm2)
289
529
961
Pitch (mm)
1
Height (mm)
1.6
2.23
IGLOOe Devices
Status
M1 IGLOOe Devices
Status
AGLE600
Production
AGLE3000
Production
M1AGLE3000
Production
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1AGLE3000V2-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOOe 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1AGLE3000V2-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOOe 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1AGLE3000V2-FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
M1AGLE3000V2-FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOOe 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1AGLE3000V2-FGG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology