參數(shù)資料
型號： M25P16-VMW6TP
廠商： 意法半導(dǎo)體
元件分類： DRAM
英文描述： 4 Mbit Uniform Sector, Serial Flash Memory
中文描述： 4兆位統(tǒng)一部門，串行閃存
文件頁數(shù)： 5/55頁
文件大?。?/td> 335K
代理商： M25P16-VMW6TP
M25P16
List of figures
5/55
List of figures
Figure 1.
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Figure 3.
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Figure 5.
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Figure 7.
Figure 8.
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Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SO8, VFQFPN and VDFPN connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SO16 connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Bus master and memory devices on the SPI bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Hold condition activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write Enable (WREN) instruction sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Write Disable (WRDI) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Read Identification (RDID) instruction sequence and data-out sequence . . . . . . . . . . . . . 21
Read Status Register (RDSR) instruction sequence and data-out sequence . . . . . . . . . . 23
Write Status Register (WRSR) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Read Data Bytes (READ) instruction sequence and data-out sequence . . . . . . . . . . . . . . 26
Read Data Bytes at Higher Speed (FAST_READ) instruction sequence
and data-out sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Page Program (PP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Sector Erase (SE) instruction sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Bulk Erase (BE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Deep Power-down (DP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Release from Deep Power-down and Read Electronic Signature (RES) instruction
sequence and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Release from Deep Power-down (RES) instruction sequence. . . . . . . . . . . . . . . . . . . . . . 34
Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Write Protect setup and hold timing during WRSR when SRWD = 1 . . . . . . . . . . . . . . . . . 45
Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Quad Flat Package No lead,
6 × 5 mm, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
VDFPN8 (MLP8) 8-lead Very thin Dual Flat Package No lead, 8 × 6mm,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
SO8N – 8 lead Plastic Small Outline, 150 mils body width, package outline . . . . . . . . . . . 49
SO8W – 8 lead Plastic Small Outline, 208 mils body width, package outline. . . . . . . . . . . 50
SO16 wide – 16-lead Plastic Small Outline, 300 mils body width, package outline . . . . . . 51
Figure 15.
Figure 16.
Figure 17.
Figure 18.
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Figure 21.
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Figure 31.
相關(guān)PDF資料
PDF描述
M25P16-VME3G 4 Mbit Uniform Sector, Serial Flash Memory
M25P16-VME3P 4 Mbit Uniform Sector, Serial Flash Memory
M25P16-VME3TG 4 Mbit Uniform Sector, Serial Flash Memory
M25P16-VME3TP 4 Mbit Uniform Sector, Serial Flash Memory
M25P16-VMF3G 4 Mbit Uniform Sector, Serial Flash Memory
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M25P16-VMW6YG 制造商:Micron Technology Inc 功能描述:16 MBIT, SERIAL FLASH MEMORY, 75 MHZ SPI BUS INTERFACE - Trays
M25P20 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:2 Mbit, low voltage, Serial Flash memory with 50MHz SPI bus interface
M25P20-AV3D11 制造商:Micron Technology Inc 功能描述:2MX1 NOR FLASH DIE-COM AUTOMOTIVE TEMP 3.0V - Trays
M25P20-ESU21/90 制造商:Micron Technology Inc 功能描述:SERIAL NOR - Gel-pak, waffle pack, wafer, diced wafer on film
M25P20S-VMN6TPB 制造商:Micron Technology Inc 功能描述:
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