參數(shù)資料
型號: M30302SPFP
元件分類: 微控制器/微處理器
英文描述: 16-BIT, FLASH, 16 MHz, MICROCONTROLLER, PQFP100
封裝: 14 X 20 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, LQFP-100
文件頁數(shù): 51/57頁
文件大?。?/td> 649K
代理商: M30302SPFP
C - 2
REVISION HISTORY
M16C/30P Group Datasheet
44
Figure 5.12 Timing Diagram (4) is added.
45
Figure 5.13 Timing Diagram (5) is added.
1.10
Oct 01, 2005
2
Table 1.1 Performance Outline of M16C/30P Group is partly revised.
4
Table 1.2 Product List is partly revised.
Figure 1.2 Type No., Memory Size, and Package is partly revised.
5
Table 1.3 Product Code of Mask ROM version Version for M16C/30P is
added.
Figure 1.3 Marking Diagram of Mask ROM Version for M16C/30P is
added.
6
Figure 1.4 Marking Diagram of ROM -less Version for M16C/30P is added.
6
Table 1.4 Product Code of ROM-less version for M16C/30P is added.
16
Figure 3.1 Memory Map is partly added.
23
Table 5.2 information is revised.
1.11
May 31, 2006
4
1.4 Product List information is revised.
Table 1.2 Product List is partly revised.
5
Figure 1.2 Type No., Memory Size, and Package is partly added.
7
Table 1.4 Product Code of Flash Memory version and ROM-less version
for M16C/30P is partly revised.
Figure 1.4 Marking Diagram of Flash Memory version and ROM-less
Version for M16C/30P (Top View) is partly added.
17
3. Memory information is revised.
Figure 3.1 Memory Map is partly revised.
18
Table 4.1 SFR Information(1) is partly revised.
19
Table 4.2 SFR Information(2) is partly added.
23
Table 5.1 Absolute Maximum Ratings information is revised.
26
Table 5.4 Flash Memory Version Electrical Characteristics is added.
Table 5.5 Flash Memory Version Program / Erase Voltage and Read
Operation Voltage Characteristics is added.
28
Table 5.7 Electrical Characteristics(1) is partly deleted.
29
Table 5.8 Electrical Characteristics (2) is partly revised.
33
Table 5.23 Memory Expansion and Microprocessor Modes
NOTES 3 is partly revised.
34
Table 5.24 Memory Expansion and Microprocessor Modes
NOTES 3 is partly revised.
40
Table 5.25 Electrical Characteristics (1) is partly deleted.
41
Table 5.26 Electrical Characteristics (2) is partly revised.
45
Table 5.41 Memory Expansion and Microprocessor Modes
NOTES 3 is partly revised.
46
Table 5.42 Memory Expansion and Microprocessor Modes
NOTES 3 is partly revised.
Rev.
Date
Description
Page
Summary
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PDF描述
M30302GDP-XXXFP 16-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PQFP100
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相關代理商/技術參數(shù)
參數(shù)描述
M30302SPFP#U3 功能描述:IC M16C/30P MCU ROMLESS 100QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:M16C™ M16C/30 標準包裝:250 系列:80C 核心處理器:8051 芯體尺寸:8-位 速度:16MHz 連通性:EBI/EMI,I²C,UART/USART 外圍設備:POR,PWM,WDT 輸入/輸出數(shù):40 程序存儲器容量:- 程序存儲器類型:ROMless EEPROM 大小:- RAM 容量:256 x 8 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-LCC(J 形引線) 包裝:帶卷 (TR)
M30302SPFP#U5 功能描述:MCU 3/5V 0K 100-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:M16C™ M16C/30 標準包裝:250 系列:80C 核心處理器:8051 芯體尺寸:8-位 速度:16MHz 連通性:EBI/EMI,I²C,UART/USART 外圍設備:POR,PWM,WDT 輸入/輸出數(shù):40 程序存儲器容量:- 程序存儲器類型:ROMless EEPROM 大小:- RAM 容量:256 x 8 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-LCC(J 形引線) 包裝:帶卷 (TR)
M30302SPGP 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
M30302SPGP#U3 功能描述:IC M16C/30P MCU ROMLESS 100-LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:M16C™ M16C/30 標準包裝:250 系列:80C 核心處理器:8051 芯體尺寸:8-位 速度:16MHz 連通性:EBI/EMI,I²C,UART/USART 外圍設備:POR,PWM,WDT 輸入/輸出數(shù):40 程序存儲器容量:- 程序存儲器類型:ROMless EEPROM 大小:- RAM 容量:256 x 8 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-LCC(J 形引線) 包裝:帶卷 (TR)
M30302SPGP#U5 功能描述:IC M16C/30P MCU ROMLESS 100LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:M16C™ M16C/30 標準包裝:250 系列:80C 核心處理器:8051 芯體尺寸:8-位 速度:16MHz 連通性:EBI/EMI,I²C,UART/USART 外圍設備:POR,PWM,WDT 輸入/輸出數(shù):40 程序存儲器容量:- 程序存儲器類型:ROMless EEPROM 大小:- RAM 容量:256 x 8 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-LCC(J 形引線) 包裝:帶卷 (TR)