參數(shù)資料
型號： M3062GF8NGP
元件分類： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 10 MHz, MICROCONTROLLER, PQFP100
封裝： 14 X 20 MM, 0.5 MM PITCH, PLASTIC, LQFP-100
文件頁數(shù)： 32/98頁
文件大?。?/td> 3480K
代理商： M3062GF8NGP
39
XMEGA A3U [DATASHEET]
Atmel-8386D-AVR-ATxmega64A3U-128A3U-192A3U-256A3U–03/2014
21.
USB – Universal Serial Bus Interface
21.1
Features
One USB 2.0 full speed (12Mbps) and low speed (1.5Mbps) device compliant interface
Integrated on-chip USB transceiver, no external components needed
16 endpoint addresses with full endpoint flexibility for up to 31 endpoints
One input endpoint per endpoint address
One output endpoint per endpoint address
Endpoint address transfer type selectable to
Control transfers
Interrupt transfers
Bulk transfers
Isochronous transfers
Configurable data payload size per endpoint, up to 1023 bytes
Endpoint configuration and data buffers located in internal SRAM
Configurable location for endpoint configuration data
Configurable location for each endpoint's data buffer
Built-in direct memory access (DMA) to internal SRAM for:
Endpoint configurations
Reading and writing endpoint data
Ping-pong operation for higher throughput and double buffered operation
Input and output endpoint data buffers used in a single direction
CPU/DMA controller can update data buffer during transfer
Multipacket transfer for reduced interrupt load and software intervention
Data payload exceeding maximum packet size is transferred in one continuous transfer
No interrupts or software interaction on packet transaction level
Transaction complete FIFO for workflow management when using multiple endpoints
Tracks all completed transactions in a first-come, first-served work queue
Clock selection independent of system clock source and selection
Minimum 1.5MHz CPU clock required for low speed USB operation
Minimum 12MHz CPU clock required for full speed operation
Connection to event system
On chip debug possibilities during USB transactions
21.2
Overview
The USB module is a USB 2.0 full speed (12Mbps) and low speed (1.5Mbps) device compliant interface.
The USB supports 16 endpoint addresses. All endpoint addresses have one input and one output endpoint, for a total of
31 configurable endpoints and one control endpoint. Each endpoint address is fully configurable and can be configured
for any of the four transfer types; control, interrupt, bulk, or isochronous. The data payload size is also selectable, and it
supports data payloads up to 1023 bytes.
No dedicated memory is allocated for or included in the USB module. Internal SRAM is used to keep the configuration for
each endpoint address and the data buffer for each endpoint. The memory locations used for endpoint configurations
and data buffers are fully configurable. The amount of memory allocated is fully dynamic, according to the number of
endpoints in use and the configuration of these. The USB module has built-in direct memory access (DMA), and will
read/write data from/to the SRAM when a USB transaction takes place.
To maximize throughput, an endpoint address can be configured for ping-pong operation. When done, the input and
output endpoints are both used in the same direction. The CPU or DMA controller can then read/write one data buffer
while the USB module writes/reads the others, and vice versa. This gives double buffered communication.
相關(guān)PDF資料
PDF描述
M3062GF8NFP 16-BIT, FLASH, 10 MHz, MICROCONTROLLER, PQFP100
M306H2MC-XXXFP 16-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP116
M306H3MC-XXXFP 16-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP116
M306H7MC-XXXFP 16-BIT, MROM, 16 MHz, MICROCONTROLLER, PQFP100
M306H7MG-XXXFP 16-BIT, MROM, 16 MHz, MICROCONTROLLER, PQFP100
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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M3062GF8NGP#U3 功能描述:MCU 3V 64K I-TEMP PB-FREE 100-LQ RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:M16C™ M16C/60 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
M3062GF8NGP#U5 功能描述:MCU 3V 64K PB FREE 100-LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:M16C™ M16C/60 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
M3062JFHTFP 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
M3062JFHTGP 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
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