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參數(shù)資料
| 型號： | M43E-14-44 |
| 廠商： | METHODE ELECTRONICS INC |
| 元件分類： | 插座 |
| 英文描述： | PLCC44, IC SOCKET |
| 文件頁數(shù)： | 8/10頁 |
| 文件大?。?/td> | 1586K |
| 代理商： | M43E-14-44 |
360
North and South America:
Methode Electronics, Inc. Connector Products
1700 Hicks Road Rolling Meadows, IL 60008 USA
847-392-3500 Toll Free: 800-323-6864 Fax: 847-392-9404
Email: info@methode.com Web: www.methode.com/connector/index.html
Europe:
Methode Electronics Ireland, Ltd.
11 Annacotty Business Park Limerick, Ireland
353 61 330013 Fax: 353 61 330803
Email: info@methode.ie Web: ireland.methode.com/main.html
Far East:
Methode Electronics Far East, Pte. Ltd.
1 Tuas Lane, Jurong Town Singapore 638610
65-68615444 Fax: 65-68614777
Email: sales@methode.com.sg Web: www.methode.com/mefe/index.html
Specifications
Materials
Contact Material: Beryllium Copper
Contact Plating: Tin/Lead over Nickel
I
nsulator Material: Polyphenylene Sulfide, UL 94V-0
Operating Temperature: -50°C to +125°C
Mechanical Performance
Durability: Per MIL-STD-1344, method 2016, 100 cycles
Vibration: Per MIL-STD-810C, method 514.2, 10-20,000
Hz, 5 Gs
Shock: Per MIL-STD-810C, method 516.2, 35 Gs
Acceleration: Per MIL-STD-810C, method 513.2, 15 Gs
Electrical Performance
Contact Interface Resistance:
Initial: 6.5 mΩ average
Final: 15.0 MΩ maximum after testing
Insulation Resistance: Greater than 1 x 104 megohms
Dielectric Strength: 1000 VAC continuous for 1 minute
Capacitance: Less than 1.0 pF at 1,000 Hz
Inductance:
Self: 5.0 nH, maximum at 500 KHz
Mutual: 1.0 nH, maximum at 500 KHz
Environmental Performance
Thermal Shock: Per MIL-STD-1344, method 1002,
condition A, cycled form -55°C to +85°C no
discontinuity or physical damage
Temperature/Humidity: Per MIL-STD-1344, method 1002,
85°C/85% relative humidity
Agency Approvals:
UL Component Recognition File E-48567
Methode has designed this PLCC socket to take full
advantage of surface mount technology. The exclusive
visible internal solder tails along with the use of quality high
temperature materials assure compatibility with all common
reflow processes. This unique configuration combines the
handling and real estate advantages of the J-lead with the
processing, inspection and repair advantages of the gull
wing. The small overall package dimensions allow the use
of sockets with minimum sacrifice in space. A center pad is
provided in insure structural integrity and provide a surface
for vacuum pick up or adhesive bonding. The socket
uses the same board pattern as the standard JEDEC chip
and the exposed tails insure full cleaning with maximum
drainage. The exclusive high pressure contact system
eliminates the need for gold plating while assuring a
reliable, cost effective way to provide a surface mount
socket for lead chip carriers.
Features
Patented design allows for inspection and repair of
surface mount connections
.200 (5.08) total mated height
Uses the same mounting pattern as mating chip
Fully compatible with all surface mount processing
Exposed solder tails for cleaning and maximum drainage
Center pad for vacuum pick and place robotic assemble
and/or adhesive bonding
Optional polarizing pegs available
Visual and mechanical polarization
Extraction tool slots
Contact design provides constant downward force on
chip to prevent disengagement
Preloaded contact provides low insertion force while
maintaining high normal force
Available in 20, 28, 32, 44, 52, 68 and 84 positions
5
Low Profile/Surface Mount
PLCC Socket
Patent No. 4,934,944
PART NO. KEY
213 - XXX- 60X
CASTING STYLE
1 = W/POLARIZING PEGS
2 = W/O POLARIZING PEGS
PLATING
0 = TIN/LEAD OVER NICKEL (STANDARD)
3 = TIN OVER NICKEL
NUMBER OF POSITIONS
020, 028 (SQUARE), 128 (RECTANGULAR), 032,
044, 052, 068, 084
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