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參數(shù)資料
| 型號： | M43S-10-100 |
| 廠商： | METHODE ELECTRONICS INC |
| 元件分類： | 插座 |
| 英文描述： | PLCC100, IC SOCKET |
| 文件頁數(shù)： | 6/10頁 |
| 文件大?。?/td> | 1586K |
| 代理商： | M43S-10-100 |
358
North and South America:
Methode Electronics, Inc. Connector Products
1700 Hicks Road Rolling Meadows, IL 60008 USA
847-392-3500 Toll Free: 800-323-6864 Fax: 847-392-9404
Email: info@methode.com Web: www.methode.com/connector/index.html
Europe:
Methode Electronics Ireland, Ltd.
11 Annacotty Business Park Limerick, Ireland
353 61 330013 Fax: 353 61 330803
Email: info@methode.ie Web: ireland.methode.com/main.html
Far East:
Methode Electronics Far East, Pte. Ltd.
1 Tuas Lane, Jurong Town Singapore 638610
65-68615444 Fax: 65-68614777
Email: sales@methode.com.sg Web: www.methode.com/mefe/index.html
Ultra Low Profile/Surface Mount
PLCC Socket
Patent No. 4,934,944
Specifications
Materials
Contact Material: Beryllium Copper
Contact Plating: Tin/Lead over Nickel
I
nsulator Material: Polyphenylene Sulfide, UL 94V-0
Operating Temperature: -50°C to +125°C
Mechanical Performance
Durability: Per MIL-STD-1344, method 2016, 100 cycles
Vibration: Per MIL-STD-810C, method 514.2,10-20,000
Hz, 5 Gs
Shock: Per MIL-STD-810C, method 513.2, 15 Gs
Acceleration: Per MIL-STD-810C, method 513.2, 15 Gs
Electrical Performance
Contact Interface Resistance:
Initial: 6.5 milliohms average
Final: 15.0 milliohms maximum after testing
Insulation Resistance: Greater than 1 x 104 megohms
Dielectric Strength: 1000 VAC continuous for 1 minute
Capacitance: Less than 1.0 pF at 1,000 Hz
Inductance:
Self: 5.0 nH, maximum at 500 KHz
Mutual: 1.0 nH, maximum at 500 KHz
Environmental Performance
Thermal Shock: Per MIL-STD-1344, method 1003,
condition A, cycled form -55°C to +85°C no
discontinuity or physical damage
Temperature/Humidity: Per MIL-STD-1344, method 1002,
85°C/85% relative humidity
Agency Approvals:
UL Component Recognition File E-48567
Methode has designed this PLCC socket to take full
advantage of surface mount technology. The exclusive
visible internal solder tails along with the use of quality high
temperature materials assure compatibility with all common
reflow processes. This unique configuration combines
the handling and real estate advantages of the J-lead with
the processing, inspection and repair advantages of the
gull wing. The small overall package dimensions allow
the use of sockets with minimum sacrifice in space. A
center pad is provided in insure structural integrity and
provide a surface for vacuum pick up or adhesive bonding.
The socket uses the same board pattern as the standard
chip conforming to JEDEC specification MO-052 and the
exposed tails insure full cleaning with maximum drainage.
The exclusive high pressure contact system eliminates the
need for gold plating while assuring a reliable, cost effective
way to provide a surface mount socket for
Features
Patented design allows for inspection and repair of
surface mount connections
.150 (3.81) overall height
Uses the same mounting pattern as mating chip
Fully compatible with all surface mount processing
Exposed solder tails for cleaning and maximum drainage
Center pad for vacuum pick and place robotic assemble
and/or adhesive bonding
Optional polarizing pegs available
Visual and mechanical polarization
Extraction tool slots
Contact design provides constant downward force on
chip to prevent disengagement
Preloaded contact provides low insertion force while
maintaining high normal force
Available in 32 positions
PART NO. KEY
213 - 032- 70X
CASTING STYLE
1 = W/POLARIZING PEGS
2 = W/O POLARIZING PEGS
PLATING
0 = TIN/LEAD OVER NICKEL (STANDARD)
3 = TIN OVER NICKEL
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