參數(shù)資料
型號(hào): M48Z35AY-70PC1
廠商: 意法半導(dǎo)體
英文描述: 256 Kbit 32Kb x8 ZEROPOWER SRAM
中文描述: 256千位的32KB的SRAM x8 ZEROPOWER
文件頁數(shù): 2/18頁
文件大?。?/td> 135K
代理商: M48Z35AY-70PC1
M48Z35, M48Z35Y
2/18
Figure 2A. DIP Pin Connections
A1
A0
DQ0
DQ1
DQ2
VSS
A7
A6
A5
A4
A3
A2
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
W
DQ5
DQ4
DQ3
A12
A14
VCC
AI01617D
M48Z35
M48Z35Y
8
9
10
11
12
13
14
1
2
3
4
5
6
7
16
15
28
27
26
25
24
23
22
21
20
19
18
17
Table 2. Absolute Maximum Ratings
(1)
Note: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational section
of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect
reliability.
2.
Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
CAUTION:
Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.
CAUTION:
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
Symbol
Parameter
Value
Unit
T
A
Ambient Operating Temperature
Grade 1
Grade 6
0 to 70
–40 to 85
°C
T
STG
Storage Temperature (V
CC
Off)
SNAPHAT
SOIC
–40 to 85
–55 to 125
°C
T
SLD (2)
Lead Solder Temperature for 10 seconds
260
°C
V
IO
Input or Output Voltages
–0.3 to 7
V
V
CC
Supply Voltage
–0.3 to 7
V
I
O
Output Current
20
mA
P
D
Power Dissipation
1
W
Figure 2B. SOIC Pin Connections
AI02303C
8
9
10
11
12
13
14
2
3
4
5
6
7
22
21
20
19
18
17
16
15
28
27
26
25
24
23
1
A1
A0
DQ0
DQ1
DQ2
VSS
A7
A6
A5
A4
A3
A2
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
W
DQ5
DQ4
DQ3
A12
A14
VCC
M48Z35Y
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