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參數(shù)資料
| 型號(hào)： | M74VHC1GT50DTT1G |
| 廠商： | ON Semiconductor |
| 文件頁(yè)數(shù)： | 6/6頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC BUFF CMOS LVL/SFTR N-I 5TSOP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | 74VHC |
| 邏輯類型： | 緩沖器/線路驅(qū)動(dòng)器，非反相 |
| 元件數(shù)： | 1 |
| 每個(gè)元件的位元數(shù)： | 1 |
| 輸出電流高，低： | 8mA，8mA |
| 電源電壓： | 1.65 V ~ 5.5 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-TSOP（0.059"，1.50mm 寬）5 引線 |
| 供應(yīng)商設(shè)備封裝： | 5-TSOP |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁(yè)面： | 1121 (CN2011-ZH PDF) |
| 其它名稱： | M74VHC1GT50DTT1GOSDKR |
MC74VHC1GT50
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
MIN
MAX
MILLIMETERS
A
3.00 BSC
B
1.50 BSC
C
0.90
1.10
D
0.25
0.50
G
0.95 BSC
H
0.01
0.10
J
0.10
0.26
K
0.20
0.60
L
1.25
1.55
M
0
10
S
2.50
3.00
12
3
54
S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
C AB
T
0.10
2X
T
0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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MC74VHC1GT50/D
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M74VHC1GT50DTT1G | 制造商:ON Semiconductor 功能描述:Logic IC 制造商:ON Semiconductor 功能描述:IC, NON INVERTING BUFFER, SOT-23-5 |
| M74VHC1GT66D | 制造商:Rochester Electronics LLC 功能描述: 制造商:ON Semiconductor 功能描述: |
| M74VHC1GT66DFT1G | 功能描述:模擬開關(guān) IC Hi Speed Analog Sw. Industrial Temp RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| M74VHC1GT66DFT2G | 功能描述:多路器開關(guān) IC Hi Speed Analog Sw. Industrial Temp RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| M74VHC1GT66DTT1G | 功能描述:模擬開關(guān) IC Hi Speed Analog Sw. Industrial Temp RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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