參數(shù)資料
型號(hào): M95160-WMB6
廠商: 意法半導(dǎo)體
元件分類: EEPROM
英文描述: 16Kbit and 8Kbit Serial SPI Bus EEPROM With High Speed Clock
中文描述: 16Kbit和8Kbit SPI總線串行EEPROM的高速時(shí)鐘
文件頁(yè)數(shù): 4/40頁(yè)
文件大?。?/td> 648K
代理商: M95160-WMB6
M95160, M95080
4/40
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 18.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 33
Table 24. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data. . . . . . . . . . 33
Figure 19.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 34
Table 25. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Mechanical Data . . . . 34
Figure 20.UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm2, Outline
35
Table 26. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm2, Data.
35
Figure 21.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 36
Table 27. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 36
Figure 22.TSSOP8 3x3mm2 – 8 lead Thin Shrink Small Outline, 3x3mm2 body size, Package Outline
37
Table 28. TSSOP8 3x3mm2 – 8 lead Thin Shrink Small Outline, 3x3mm2 body size, Mechanical Data
37
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 29. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 30. How to Identify Present and Previous Products by the Process Identification Letter . . . 38
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 31. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
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