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參數(shù)資料
| 型號(hào)： | MA4FCP300-T |
| 元件分類： | PIN二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | FLIP CHIP-2 |
| 文件頁(yè)數(shù)： | 1/4頁(yè) |
| 文件大小： | 107K |
| 代理商： | MA4FCP300-T |
B
C
D
E
D
Cathode Mark
Top View
Bottom View
Side View
F
A
Features
n
Low Series Resistance : 2.6
n
Low Capacitance : 45 fF
n
Fast Switching Speed : 40 nS
n
Silicon Nitride Passivation
n
Polyimide Scratch Protection
n
Designed for Automated Pick and Place Insertion
n
Rugged by Design
Description
M/A-COM’s MA4FCP Series consists of Silicon Flip Chip PIN
diodes fabricated with M/A-COM’s patented HMIC process. This
diode is fabricated on epitaxial wafers using a process designed for
repeatable electrical characteristics and extremely low parasitics.
This diode is fully passivated with Silicon Nitride and has an
additional layer of Polyimide for scratch protection. These
protective coatings prevent damage to the junction during
automated or manual handling. This flip chip configuration is
suitable for pick and place insertion.
Applications
The small 0315 outline and low 0.12 pS RC product, make the
device useful for multi-throw switch and switched phase shifter
circuits requiring < 40 nS switching speeds up to 18 GHz operating
frequency.
Silicon Flip Chip
PIN Diode
MA4FCP300
V 1.00
1269 Outline Drawing
Parameter
Value
Forward Current
100 mA
Reverse Voltage
-100 V
Operating Temperature
-55 °C to +150 °C
Storage Temperature
-55 °C to +150 °C
Dissipated Power
150 mW
Mounting Temperature
+300 °C for 10 seconds
Junction Temperature
+175 °C
Absolute Maximum Ratings
@ 25 °C
1
1. Exceeding any of these values may result in permanent
damage
Nominal Die Dimensions
Dim
Inches
Millimeters
Min
Max
Min
Max
A
0.0269
0.0289
0.683
0.733
B
0.0135
0.0155
0.343
0.393
C
0.0040
0.0080
0.102
0.203
D
0.0041
0.0061
0.105
0.155
E
0.0124
0.0144
0.315
0.365
F
0.0069
0.0089
0.175
0.225
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