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參數(shù)資料
| 型號： | MAAPGM0036-DIE |
| 英文描述： | 1.2-3.2 GHz 1.2W Power Amplifier |
| 中文描述： | 1月2日至3月二號頻率為1.2W功率放大器 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 260K |
| 代理商： | MAAPGM0036-DIE |
1.2-3.2 GHz 1.2W Power Amplifier
MAAPGM0036-DIE
RO-P-DS-3017 B
Preliminary Information
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com
for additional data sheets and product information.
5
Mechanical Information
Chip Size: 2.986 x 2.982 x 0.075 mm
(
118 x 117 x 3 mils)
Pad
Size (
μ
m)
RF In and Out
100 x 200
DC Drain Supply Voltage VDD
200 x 150
DC Gate Supply Voltage VGG
150 x 150
Size (mils)
4 x 8
8 x 6
6 x 6
Bond Pad Dimensions
Figure 5. Die Layout
0
0
0
0.154mm.
1.492mm.
2.830mm.
2.982mm.
2.830mm.
1.492mm.
2
2
0.152mm.
0
0
I
V
G
V
G
V
D
V
D
O
2
2
Chip edge to bond pad dimensions are shown to the center of the bond pad.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MAAPGM0037-DIE | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Amplifier, Power, 1.0W 6.5-12.5 GHz |
| MAAPGM0038 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:1.2W Power Amplifier 9.0-12.0 GHZ |
| MAAPGM0038-DIE | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:1.2W C/Ku-Band Power Amplifier 7.5-13.5 GHz |
| MAAPGM0040 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:11.0-15.0 GHz 0.5 W Power Amplifier |
| MAAPGM0041 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Amplifier, Power, 1.3W 11.5 - 15.0 GHz |
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