28
MAC7100 Microcontroller Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Electrical Characteristics
3.10.4 ATD Timing Specifications
6
Maximum leakage occurs at maximum operating temperature. Current decreases by approximately one-half for
each 8 to 12
°
C, in the ambient temperature range of 50 to 125
°
C.
Below disruptive current conditions, the channel being stressed has conversion values of 0x3FF for analog inputs
greater than V
RH
and 0x000 for values less than V
RL
. This assumes that V
DD
A
≥
AV
RH
and V
RL
≥
V
SS
A due to the
presence of the sample amplifier. Other channels are not affected by non-disruptive conditions.
Coupling Ratio, K, is defined as the ratio of the output current, I
OUT
, measured on the pin under test to the injection
current, I
INJ
, when both adjacent pins are overstressed with the specified injection current. K = I
OUT
÷
I
INJ
. The input
voltage error on the channel under test is calculated as Verr = I
INJ
x K x R
S
.
Total injection current is determined by the number of channels injecting (for example, 15), external injection voltage
(V
INJ
– V
POSCLAMP
, or V
INJ
– V
NEGCLAMP
the same values. To determine the error voltage on the converted channel, only the two adjacent channels are
expected to contribute to the error voltage: V
errj
= (V
INJ
– V
CLAMP
)
×
K
×
2.
10
For a maximum sampling error of the input voltage
≤
1LSB, then the external filter capacitor, C
f
≥
1024
×
C
SAMP
. The
value of C
SAMP
in the new design may be reduced, or increased slightly.
7
8
9
Table 30. ATD Performance Specifications
1
1
All voltages referred to V
SS
A, V
DD
A = 5.0 V±10%, ATD clock = 2.1 Mhz., –40 to 125
°
C.
Note: 1 LSB = 1 Count (At V
REF
= 5.12 V, one 8 bit count = 20 mV, one 10-bit count = 5 mV)
These values include quantization error which is inherently 1/2 count for any A/D converter.
This value is based on error attributed to the specified leakage value of TBD nA resulting in an error of less than 1/2
LSB (2.5 mV). If operating conditions are less than worst case or leakage-induced error is acceptable, larger values
of source resistance is allowable.
Num C
Rating
Symbol
Min
Typ
Max
Unit
T1
T2
T3
T4
T5
D 10-bit Resolution
D 10-bit Differential Nonlinearity
2
D 10-bit Integral Nonlinearity
2
D 10-bit Absolute Error
2, 3
D Max input Source Impedance
4
LSB
DNL
INL
AE
R
S
—
–1
–2
–2.5
—
5
—
—
—
—
—
1
2
2.5
100
mV
2
Counts
Counts
Counts
k
3
4
Table 31. ATD Timing Specifications
Num C
Rating
Symbol
Min
Typ
Max
Unit
U1
U2
U3
D ATD Module Clock Frequency
D ATD Conversion Clock Frequency
D ATD 10-bit Conversion Period
*
F
clk
F
atdclk
N
CONV10
*
T
CONV10
—
0.5
14
*
7
—
—
—
—
25.0
2.0
28
*
14
MHz
MHz
Cycles
*
μ
sec
Clock Cycles
Conv. Time
U4
D Stop Recovery Time (V
DD
A = 5.0 V)
T
SR
—
—
100
μ
sec
Table 32. ATD External Trigger Timing Specifications
Num
C
Parameter
Symbol
Min
Max
Unit
V1
D ETRIG Minimum Period
T
PERIOD
—
1 sample +
1 conv. +
1 ATD clock
—
—
2
CYCLE
V2
V3
V4
D ETRIG Minimum Pulse Width
D ETRIG Level Recovery
1
D Conversion Start Delay
t
PW
t
LR
t
DLY
2
1
—
SYS CLK
SYS CLK
SYS CLK
1
Time prior to end of conversion that the ETRIG pin must be deactivated so that another conversion sequence does
not start.
F
Freescale Semiconductor, Inc.
n
.