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| 型號(hào)： | MADS-002545-1307MR |
| 元件分類： | 射頻混頻器 |
| 英文描述： | SILICON, MEDIUM BARRIER SCHOTTKY, KU BAND, MIXER DIODE |
| 封裝： | 0.60 X 0.60 MM, CASE 1307, 4 PIN |
| 文件頁(yè)數(shù)： | 2/3頁(yè) |
| 文件大?。?/td> | 59K |
| 代理商： | MADS-002545-1307MR |
2
SURMOUNTTM Medium Barrier Silicon Schottky Diodes:
Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
M/A-COM Products
Rev. V2
MADS-002545-1307M
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
Model
Number
Type
Recommended
Frequency Range
Vf @ 1 mA
( mV )
ΔVf @ 1mA
( mV )
Ct @ 0V
( pF )
Rt Slope Resistance
( Vf1–Vf2 ) /
( 10.5mA – 9.5mA )
(
Ω )
MADS-002545-1307M
Medium
Barrier
DC - 18 GHz
470 Max
390 Typ
10 Max
0.22 Max
0.11 Typ
10 Typical
18 Max
Electrical Specifications @ + 25 °C (Measured as Single Diodes)
Rt is the dynamic slope resistance where Rt = Rs + Rj where Rj =26 / Idc ( Idc is in mA ) and Rs is the Ohmic Resistance.
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for individual
components. The top surface of the die has a protective
polyimide
coating
to
minimize
damage.
The rugged construction of these SurMount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry standard
electrostatic discharge (ESD) control is required at
all times, due to the sensitive nature of Schottky
junctions. Bulk handling should insure that abrasion
and mechanical shock are minimized.
Die Bonding
Die attach for these devices is made simple through
the use of surface mount die attach technology.
Mounting pads are conveniently located on the bottom
surface of these devices, and are opposite the active
junction. The devices are well suited for high
temperature solder attachment onto hard substrates.
80Au/20Sn
and
Sn63/Pb36/Ag2
solders
are
acceptable for usage. Maximum solder re-flow
temperature is 320 °C for 10 seconds.
Absolute Maximum Ratings @ 25 °C
1
1. Operation of this device above any one of these parameters
may cause permanent damage.
Parameter
Absolute Maximum
Operating Temperature
-40 °C to +125 °C
Storage Temperature
-40 °C to +150 °C
Junction Temperature
+175 °C
Die Bonding Temperature
+320 °C for 10 sec.
Forward Current
20 mA
Reverse Voltage l - 10
μ A l
I -5 V I
RF C.W. Incident Power
+20 dBm C.W.
RF & DC Dissipated Power
50 mW
Die Bonding
For Hard substrates, we recommend utilizing a
vacuum tip and force of 60 to 100 grams applied
uniformly to the top surface of the device, using a
hot gas bonder with equal heat applied across the
bottom mounting pads of the device. When soldering
to soft substrates, it is recommended to use a
lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are
aligned with the circuit board mounting pads. Reflow
the solder paste by applying Equal heat to the circuit
at both die-mounting pads. The solder joint must Not
be made one at a time, creating un-equal heat flow
and thermal stress. Solder reflow should Not be
performed by causing heat to flow through the top
surface of the die. Since the HMIC glass is transparent, the
edges of the mounting pads can be visually inspected
through the die after die attach is completed.
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|---|---|
| MADS-002545-1307MT | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip |
| MADS-003000-1292 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Surface Mount Schottky Dual Crossover Quad |
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| MADS-003000-1292LT | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Surface Mount Schottky Dual Crossover Quad |
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