- 您現(xiàn)在的位置：買(mǎi)賣IC網(wǎng) > PDF目錄8843 > MAX13035EETE+ (Maxim Integrated Products)IC TRANSL LOGIC 16-TQFN PDF資料下載
參數(shù)資料
| 型號(hào)： | MAX13035EETE+ |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 5/18頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC TRANSL LOGIC 16-TQFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 75 |
| 邏輯功能： | 變換器，雙向 |
| 位數(shù)： | 6 |
| 輸入類型： | 邏輯 |
| 輸出類型： | 邏輯 |
| 數(shù)據(jù)速率： | 100Mbps |
| 通道數(shù)： | 6 |
| 輸出/通道數(shù)目： | 1 |
| 差分 - 輸入:輸出： | 無(wú)/無(wú) |
| 傳輸延遲（最大）： | 6.5ns |
| 電源電壓： | 2.2 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 16-WQFN 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 16-TQFN-EP（4x4） |
| 包裝： | 管件 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)當(dāng)前第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)
Clock Return (CLK_RET)
The MAX13035E features a CLK_RET output that returns
the clock signal applied to CLK_VL. CLK_VL and
CLK_VCC are identical to the other I/O channels, the only
difference being that CLK_VCC is internally tied to the
VCC side of CLK_RET (see the Functional Diagram).
Application Information
Layout Recommendations
Use standard high-speed layout practices when laying
out a board with the MAX13030E–MAX13035E. For
example, to minimize line coupling, place all other signal
lines not connected to the MAX13030E–MAX13035E at
least 1x the substrate height of the PCB away from the
input and output lines of the MAX13030E–MAX13035E.
Power-Supply Decoupling
To reduce ripple and the chance of introducing data
errors, bypass VL and VCC to ground with 0.1F ceram-
ic capacitors. Place all capacitors as close as possible
to the power-supply inputs. For full ESD protection,
bypass VCC with a 1F ceramic capacitor located as
close as possible to the VCC input.
Unidirectional vs. Bidirectional Level
Translator
The MAX13030E–MAX13035E bidirectional level trans-
lators can operate as a unidirectional device to trans-
late signals without inversion. These devices provide
the smallest solution (UCSP package) for unidirectional
level translation without inversion.
Use with External Pullup/Pulldown
Resistors
Due to the architecture of the MAX13030E–
MAX13035E, it is not recommended to use external
pullup or pulldown resistors on the bus. In certain appli-
cations, the use of external pullup or pulldown resistors
is desired to have a known bus state when there is no
active driver on the bus. For example, this may happen
when interfacing to a memory card slot with no memory
card inserted. The MAX13030E–MAX13035E include
internal pullup current sources that set the bus state
when the device is enabled. In shutdown mode,
the state of I/O VCC_ and I/O VL_ is dependent on
the selected part version (see
Ordering Information/
Selector Guide for further information).
Open-Drain Signaling
The MAX13030E–MAX13035E are designed to pass
open-drain as well as CMOS push-pull signals. When
used with open-drain signaling, the rise time is domi-
nated by the interaction of the internal pullup current
source and the parasitic load capacitance. The
MAX13030E–MAX13035E include internal rise time
accelerators to speed up transitions, eliminating any
need for external pullup resistors.
SD Card Detection
SD, MiniSD, MMC and similar types of cards provide
detection of a card through a pullup resistor on one of
the DAT lines, or by use of a mechanical switch. This
pullup resistor is internal to the memory card itself. The
MAX13030E–MAX13035E only support detection of
a memory card through a mechanical switch, and it
is recommended that the internal resistor for card
detection be switched off by the command interface.
For example, when using SD cards, the command
SET_CLR_CARD_DETECT (ACMD42) disables this
resistor.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profiles, as well as the latest information on reliabil-
ity testing results, go to Maxim’s web site at
www.maxim-ic.com/ucsp to find the Application Note:
UCSP – A Wafer-Level Chip-Scale Package.
Chip Information
Process: BiCMOS
MAX13030E–MAX13035E
6-Channel High-Speed Logic-Level Translators
______________________________________________________________________________________
13
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| V150B5M200B2 | CONVERTER MOD DC/DC 5V 200W |
| MAX13047EEVB+T | IC XLATOR BIDIRECT LEVEL 10UTQFN |
| V150B5M200B | CONVERTER MOD DC/DC 5V 200W |
| V110B36M200BG3 | CONVERTER MOD DC/DC 36V 200W |
| MAX3001EAUP+T | IC TRANSLATOR LEVEL 8CH 20-TSSOP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX13035EETE+ | 功能描述:轉(zhuǎn)換 - 電壓電平 6Ch High-Speed RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MAX13035EETE+T | 功能描述:轉(zhuǎn)換 - 電壓電平 6Ch High-Speed RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MAX13035EEVKIT+ | 制造商:Maxim Integrated Products 功能描述:EVALUATION KIT - Rail/Tube |
| MAX13036ATI+ | 功能描述:接口 - 專用 Auto Contact Monitor & Level Shifter RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59 |
| MAX13036ATI+T | 功能描述:接口 - 專用 Auto Contact Monitor & Level Shifter RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。