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參數(shù)資料
| 型號(hào)： | MAX13223EEUP+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 5/12頁 |
| 文件大小： | 0K |
| 描述： | IC TXRX RS-232 2TX/2RX 20-TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | 收發(fā)器 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 2/2 |
| 規(guī)程： | RS232 |
| 電源電壓： | 3 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 20-TSSOP |
| 包裝： | 帶卷 (TR) |
MAX13223E
±70V Fault-Protected, 3.0V to 5.5V,
2Tx/2Rx RS-232 Transceiver
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, TA = +25°C, unless other-
wise noted. For VCC = +3.0V to +3.6V, C1 = C2 = C3 = 0.1F, C4 = 1F. For VCC = +4.5V to +5.5V, C1 = 47nF, C2 = C3 = 330nF,
C4 = 1F.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
VCC ...................................................................... -0.3V to +7.0V
V+ ..........................................................................-0.3V to +7.0V
V- ...........................................................................+0.3V to -7.0V
V+ to V- ................................................................................+13V
Input Voltages
T1IN, T2IN, EN, FORCEON, FORCEOFF ..........-0.3V to +6.0V
R1IN, R2IN .......................................................................±70V
Output Voltages
T1OUT, T2OUT ................................................................±70V
R1OUT, R2OUT, INVALID ......................-0.3V to (VCC + 0.3V)
Short-Circuit Duration
T1OUT, T2OUT.......................................................Continuous
Continuous Power Dissipation (TA = +70°C)
TSSOP (derate 13.6mW/°C above +70°C) ................1084mW
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature ..................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (
θJA) ........73.8°C/W
Junction-to-Case Thermal Resistance (
θJC) ................20°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
3.0
5.5
V
Supply Current
AutoShutdown disabled (FORCEON =
FORCEOFF = VCC), no load
8
15
mA
Supply Current AutoShutdown
IASD
FORCEON = GND,
FORCEOFF = VCC,
R1IN and R2IN idle, T1IN and T2IN idle
1.0
10
μA
Supply Current Shutdown
ISD
FORCEOFF = GND
1.0
10
μA
LOGIC INPUTS
Input-Logic Low
VT_IN,LO
T_IN,
EN, FORCEON, FORCEOFF,
VCC = +3.3V to +3.6V, +5.0V to +5.5V
0.8
V
VCC = +3.3V
2.0
Input-Logic High
VT_IN,HI
T_IN, FORCEON,
FORCEOFF, EN
VCC = +5.0V
2.4
V
Transmitter Input Hysteresis
VTX,INHYS
0.5
V
Input Leakage Current
IIN,LKG
T_IN,
EN, FORCEON, FORCEOFF
±0.01
±1
μA
RECEIVER OUTPUTS
Output Leakage Current
IRX,OUT,LKG
EN = VCC
±0.05
±10
μA
Output-Voltage Low
VRX,OUT,LO IOUT = 1.6mA
0.4
V
Output-Voltage High
VRX,OUT,HI IOUT = -1.0mA
VCC -
0.6
VCC -
0.2
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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