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參數資料
| 型號： | MAX14759ETA+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數： | 9/16頁 |
| 文件大小： | 0K |
| 描述： | IC ANALOG SWITCH |
| 產品培訓模塊： | Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 功能： | 開關 |
| 電路： | 1 x SPST |
| 導通狀態(tài)電阻： | 1 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 3 V ~ 5.5 V |
| 電流 - 電源： | 4.1mA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WDFN 裸露焊盤 |
| 供應商設備封裝： | 8-TDFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
2
Maxim Integrated
MAX14759/MAX14761/MAX14763
Above- and Below-the-Rails
Low On-Resistance Analog Switches
(All voltages referenced to GND, unless otherwise noted.)
VCC..........................................................................-0.3V to +6V
EN, EN1, EN2, SEL ............................... -0.3V to + (VCC + 0.3V)
A, B, A1, A2, B1, B2, COM .................... (VN - 0.3V) to Lesser of
(VP + 0.3V) or (VN + 52V)
VP .................................................................... -0.3V to Lesser of
(+52V) or (VN + 70V)
VN ........................Greater of (VCC - 40V) or (VP - 70V) to +0.3V
VP to VN.................................................................-0.3V to +70V
Continuous Current Through Switch (MAX14759) ........ Q500mA
Continuous Current Through Switch
(MAX14761, MAX14763) ........................................... Q250mA
Continuous Power Dissipation (TA = +70NC)
8-Pin TDFN Package
(derate 24.4mW/NC above +70NC) .........................1951.2mW
10-Pin TDFN Package
(derate 24.4mW/NC above +70NC) .........................1951.2mW
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +160NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
8-Pin TDFN
Junction-to-Ambient Thermal Resistance (
qJA) ..........48°C/W
Junction-to-Case Thermal Resistance (
qJC) .................8°C/W
10-Pin TDFN
Junction-to-Ambient Thermal Resistance (
qJA) ..........41°C/W
Junction-to-Case Thermal Resistance (
qJC) .................9°C/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 5V and TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Power Supply Range
VCC
3.0
5.5
V
Continuous Current Through
Switch
IA_
(MAX14759)
-500
+500
mA
(MAX14761/MAX14763)
-250
+250
Supply Current
ICC
VCC ≤ 4.7V
VEN_ = VCC
4.1
10
mA
VEN_ = VCC/2
4.1
10
VCC > 4.7V
VEN_ = VCC
2.5
6
VEN_ = VCC/2
2.5
6
Analog-Signal Range
VCOM,
VA_, VB_
Switch open or closed
-25
+25
V
On-Resistance
RON
IB = Q500mA, VA = Q25V (MAX14759)
0.6
1
I
ICOM or IB_ = Q250mA, VA_= Q25V
(MAX14761/MAX14763)
1.2
2
On-Resistance Flatness
D
RON
-25V < VA < +25V, IB = Q500mA (MAX14759)
2.4
mI
-25V < VA_ < +25V, IB_ or ICOM = Q250mA
(MAX14761/MAX14763)
5.1
A, A1, A2 Off-Leakage Current
IA_(OFF)
VA = +25V, VB = 0V, Figure 1 (MAX14759)
-250
+250
nA
VA_ = +25V, VCOM or VB_= 0V, Figure 1
(MAX14761/MAX14763)
-250
+250
COM, B, B1, B2 Off-Leakage
Current
ICOM(OFF),
IB_(OFF)
VCOM or VB = 15V, VA_ = 0V, Figure 1
(MAX14759/MAX14763)
-100
+100
nA
VB_ = 15V, VA_ = 0V, Figure 1 (MAX14761)
-100
+100
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