參數(shù)資料
型號: MAX1555EZK
廠商: Maxim Integrated Products, Inc.
英文描述: PLASTIC ENCAPSULATED DEVICES
中文描述: 塑封器件
文件頁數(shù): 4/8頁
文件大?。?/td> 95K
代理商: MAX1555EZK
V. Quality Assurance Information
A. Quality Assurance Contacts: Jim Pedicord
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135
°
C biased (static) life test are shown in
Table 1
. Using these results, the Failure
Rate (
λ
) is calculated as follows:
λ
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF
192 x 4389 x 48 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ
= 22.62 x 10
-9
λ
= 22.62 F.I.T. (60% confidence level @ 25
°
C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The
Burn-In Schematic (Spec.# 06-6146) shows the static circuit used for this test. Maxim also performs 1000 hour life
test monitors quarterly for each process. This data is published in the Product Reliability Report (
RR-1M
) located
on the Maxim website at http://www.maxim-ic.com .
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.
Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85
°
C/85%RH or
HAST tests are performed quarterly per device/package family.
B. E.S.D. and Latch-Up
PN20-1 die type has been found to have all pins able to withstand a transient pulse of
±
1000V, per Mil-Std-
883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a
current of
±
250mA.
(Manager, Reliability Operations)
(Executive Director of QA)
Bryan Preeshl
Kenneth Huening (Vice President)
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