參數(shù)資料
型號: MAX2840EBC-T
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 衰減器
英文描述: 5GHz Linear Power Amplifiers
中文描述: 5150 MHz - 5350 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
封裝: 2 X 1.50 MM, UCSP-12
文件頁數(shù): 7/9頁
文件大?。?/td> 750K
代理商: MAX2840EBC-T
M
5GHz Linear Power Amplifiers
_______________________________________________________________________________________
7
For a DAC capable of sinking current only, set resistors
R1 and R2 to 0 and connect the DAC directly to the
BIAS pin. Use Equation 5 to determine the DAC current
required for a given I
CC
.
Shutdown Mode
Apply logic low to
SHDN
(pin A1) to put the MAX2840/
MAX2841 in shutdown mode. In this mode, all gain
stages are disabled and supply current drops to less
than 10μA. Note that the shutdown current is lowest
when V
SHDN
= 0.
Power Detector
The power detector generates a voltage proportional to
the output power. It is fully temperature compensated
and allows the user to set the bandwidth with an exter-
nal capacitor. For maximum bandwidth, connect a
100k
resistor from P_DET to GND and do not use any
external capacitors.
Applications Information
Supply Bypassing
V
CC
provides bias to the first- and second-stage ampli-
fiers. See the
Typical Application Circuit
for the lumped
and discrete component values used on the
MAX2840/MAX2841 EV kits for optimum RF bypassing.
In addition to RF bypass capacitors on each bias line, a
global bypass capacitor of 10μF is necessary to filter
any noise on the supply line. Route separate V
CC
bias
paths from the global bypass capacitor (star topology)
to avoid coupling between PA stages. Use the
MAX2840/MAX2841 EV kits PC board layout as a guide.
External Matching
The RFIN port requires a matching network. The RFIN
port impedance is 11 + j14
at 5.25GHz. See the
Typical Application Circuit
for recommended compo-
nent values. The RFOUT port is an open-collector out-
put that must be pulled to V
CC
through a 5.6nH RF
choke for proper biasing. Two shunt capacitors to
ground are required at the supply side of the inductor.
In addition, a matching network is required for optimum
gain, efficiency, ACPR, and output power. The load
impedance seen at the RFOUT port of the MAX2840/
MAX2841 on the EV kits is approximately 13 + j5
. This
should serve as a good starting point for the layout.
However, optimum performance is layout dependent
and some component optimization may be required.
See the
Typical Application Circuit
for the lumped and
discrete component values used on the MAX2840/
MAX2841 EV kits to achieve this impedance.
Ground Vias
Placement and type of ground vias are important to
achieve optimum gain and output power and ACPR
performance. Each ground pin requires its own via on
pad (via diameter = 8 mils) placed under the device pin
to reduce ground inductance and feedback between
stages. Use the MAX2840/MAX2841 EV kit PC board
layouts as a guide.
Layout and Thermal Management Issues
The MAX2840/MAX2841 EV kits serve as a layout
guide. Use controlled-impedance lines on all high-fre-
quency inputs and outputs. The GND pins also serve
as heatsinks. Connect all GND pins directly to the top-
side RF ground. On boards where the ground plane is
not on the component side, connect all GND pins to the
ground plane with plated multiple through holes close
to the package. PC board traces connecting the GND
pins also serve as heatsinks. Make sure the traces are
sufficiently wide.
UCSP Reliability
The chip-scale package (UCSP) is a unique package that
greatly reduces board space. UCSP reliability is integrally
linked to the user’s assembly methods, circuit board
material, and usage environment. The user should closely
review these areas when considering using a UCSP. This
form factor might not perform equally to a packaged
product through traditional mechanical reliability tests.
Performance through operating life test and moisture
resistance remains uncompromised, as it is primarily
determined by the wafer- fabrication process.
Mechanical stress performance is a greater consideration
for a UCSP. UCSP solder-joint contact integrity must be
considered because the package is attached through
direct solder contact to the user’s PC board. Testing to
characterize the UCSP reliability performance shows that
it is capable of performing reliably through environmental
stresses. Results of environmental stress tests and addi-
tional usage data and recommendations are detailed in
the UCSP application note, which can be found on
Maxim’s website, www.maxim-ic.com.
Users should be aware that, as with any interconnect
system, there are electromigration-based current limits,
which in this case apply to the maximum allowable cur-
rent in the bumps. Reliability is a function of this cur-
rent, the duty cycle, lifetime, and bump temperature.
See the
Absolute Maximum Ratings
section of the data
sheet for any specific limitation, listed under
“Continuous Operating Lifetime.”
Chip Information
TRANSISTOR COUNT: 1263
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