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參數(shù)資料
| 型號： | MAX3658 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | 622Mbps, Low-Noise, High-Gain Transimpedance Preamplifier |
| 中文描述： | 622Mbps、低噪聲、高增益互阻前置放大器 |
| 文件頁數(shù)： | 11/14頁 |
| 文件大小： | 2011K |
| 代理商： | MAX3658 |
Pad Coordinates
Table 2 gives center pad coordinates for the MAX3658
bond pads. Refer to application note HFAN-8.0.1:
Understanding Bonding Coordinates and Physical Die
Size
for more information on bond-pad coordinates.
M
622Mbps, Low-Noise, High-Gain
Transimpedance Preamplifier
______________________________________________________________________________________
11
FILT
20k
400
V
CC
20pF
Figure 7. FILT Interface
MON
V
CC
Figure 8. MON Interface
Table 2. Bond-Pad Information
NAME
COORDINATES (μm)
X
16.6
18.0
18.0
16.6
445.0
456.2
455.0
455.0
254.6
135.6
PAD
MAX3658A
MON
GND
N.C.
OUT+
OUT-
N.C.
GND
V
CC
IN
FILT
MAX3658B
MON
GND
N.C.
OUT-
OUT+
N.C.
GND
V
CC
IN
FILT
Y
BP1
BP2
BP3
BP4
BP5
BP6
BP7
BP8
BP9
BP10
818.6
543.4
425.8
39.4
39.4
155.6
565.8
818.6
818.6
818.6
Chip Information
TRANSISTOR COUNT: 833
PROCESS: GST-4
TOP VIEW
MAX3658
AGP**
3
FILT
2
IN
6
OUT+
4
MON
5
GND
7
OUT-
8
GND
1
V
CC
TDFN*
(3mm x 3mm)
*THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD
GROUND FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE.
**AGP = DEVICE TOPMARK.
Pin Configuration
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3658AE/D | 制造商:Maxim Integrated Products 功能描述:622MBPS LOW-NOISE HIGH-GAIN TRANS - Gel-pak, waffle pack, wafer, diced wafer on film |
| MAX3658AETA | 制造商:Maxim Integrated Products 功能描述:622MBPS, LOW-NOISE, HIGH-GAIN TRANSIMPEDANCE - Rail/Tube |
| MAX3658AETA+ | 制造商:Maxim Integrated Products 功能描述:SP AMP TRANSIMPEDANCE AMP SGL 8TDFN EP - Rail/Tube |
| MAX3658AETA+T | 功能描述:跨阻抗放大器 622Mbps Transimpedance Pream RoHS:否 制造商:Texas Instruments 封裝 / 箱體:SOIC-14 帶寬:3 MHz 工作電源電壓:36 V 電源電流:5.5 mA 工作溫度范圍:- 40 C to + 85 C 封裝:Tube |
| MAX3658AETA-T | 功能描述:跨阻抗放大器 622Mbps Transimpedance Pream RoHS:否 制造商:Texas Instruments 封裝 / 箱體:SOIC-14 帶寬:3 MHz 工作電源電壓:36 V 電源電流:5.5 mA 工作溫度范圍:- 40 C to + 85 C 封裝:Tube |
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