參數(shù)資料
型號: MAX3766
廠商: Maxim Integrated Products, Inc.
英文描述: Quad LVDS Transmitter with Flow-Through Pinout 16-TSSOP -40 to 85
中文描述: 622Mbps、LAN/WAN激光驅(qū)動器,帶有自動功率控制及安全關(guān)斷
文件頁數(shù): 15/20頁
文件大小: 250K
代理商: MAX3766
M
622Mbps LAN/WAN Laser Driver with
Automatic Power Control and S afety S hutdown
______________________________________________________________________________________
15
Layout Considerations
The MAX3766 is a high-frequency product. The perfor-
mance of the circuit is largely dependent upon the lay-
out of the circuit board.
Use a multilayer circuit board with a dedicated ground
plane. Use short laser package leads placed close to
OUT+ and OUT- to keep output inductance low. Power
supplies should be capacitively bypassed to the
ground plane with surface-mount capacitors placed
near the power-supply pins.
S olutions to Common Problems
1)
Laser output is ringing and contains overshoot.
This is often caused by inductive laser packaging.
Try reducing the lead length of the laser pins. Modify
the compensation network to reduce the driver’s out-
put edge speed (see Design Procedure). This prob-
lem can also occur if the voltage at OUT+, OUT-, or
BIAS is below V
CC
- 2.5V. Test this by increasing the
supply voltage, or reducing the modulation current.
2)
Low-frequency oscillation on the bias-current
output.
Ensure C
MD
0.1μF.
3)
Modulation driver is not needed.
If only the bias-current driver and safety circuits are
needed, connect IN+ to V
CC
, and leave IN- uncon-
nected. Connect OUT+ and OUT- to the supply.
Leave MOD, TC, and REF2 unconnected.
4)
APC is not needed.
If only the high-speed modulation driver is used,
connect BIAS to V
CC
, and leave POWERSET, MD,
FAIL
, and BIASMAX unconnected. Connect SAFETY
to ground.
5)
Laser edge switching speed is low.
Refer to the Design Bias Filter section. It may be
necessary to select L
BIAS
with a higher self-resonat-
ing frequency.
Wire Bonding Die
The MAX3766 uses bondpads with gold metalization.
Make connections to the die with gold wire only, using
ball bonding techniques. Wedge bonding is not recom-
mended. Pad size is 4 mils (0.1mm) square. Die thick-
ness is typically 15 mils (0.38mm).
Interfac e Models
Figure 11 shows typical models for the inputs and out-
puts of the MAX3766, including package parasitics. If
dice are used, replace the package parasitic elements
with bondwire parasitic elements.
PECL
OUTPUT
IN
V
CC
- 2V
V
CC
V
CC
50
68
R2
2.87k
R3
11.8k
R1
10k
180
SINGLE-ENDED TERMINATION IS SHOWN. THE OTHER INPUT SHOULD BE
TERMINATED SIMILARLY, OR CONNECTED TOV
CC
- 1.3V.
MAX3766
RF OR NON-
PECL OUTPUT
IN
MAX3766
TTL OR
CMOS OUTPUT
IN
MAX3766
Figure 9. Input Terminations
FAIL
V
CC
V
CC
RESET
FAIL
OUT+
5.1k
5.1k
100k
V
CC
LASER
MAX3766
Figure 10. External Laser Shutdown Circuit
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參數(shù)描述
MAX3766E/D 功能描述:激光驅(qū)動器 RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube
MAX3766E/D DIE 制造商:Maxim Integrated Products 功能描述:
MAX3766EEP 功能描述:激光驅(qū)動器 622Mbps LAN/WAN RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube
MAX3766EEP+ 功能描述:激光驅(qū)動器 622Mbps LAN/WAN RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube
MAX3766EEP+T 功能描述:激光驅(qū)動器 622Mbps LAN/WAN RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube