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參數(shù)資料
| 型號： | MAX4292ESA+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 5/18頁 |
| 文件大小： | 0K |
| 描述： | IC OP AMP R-R I/O 8-SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 100 |
| 放大器類型： | 通用 |
| 電路數(shù)： | 2 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 0.2 V/µs |
| 增益帶寬積： | 500kHz |
| 電流 - 輸入偏壓： | 15nA |
| 電壓 - 輸入偏移： | 200µV |
| 電流 - 電源： | 100µA |
| 電流 - 輸出 / 通道： | 20mA |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V，±0.9 V ~ 2.75 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOIC |
| 包裝： | 管件 |
MAX4291/MAX4292/MAX4294
Ultra-Small, 1.8V, Power,
Rail-to-Rail I/O Op Amps
______________________________________________________________________________________
13
For a 1V output and a current load of 50mA, the choice
of resistors can be R1 = 2
, R2 = 100k, and R3 =
1M
.
UCSP Information
Layout Issues
Design the layout for the IC to be as compact as possi-
ble to minimize parasitics. The UCSP uses a bump
pitch of 0.5mm (19.7mil) and bump diameter of 0.3
(~12mil). Therefore, lay out the solder-pad spacing on
0.5mm (19.7mil) centers, using a pad size of 0.25mm
(~10mil) and a solder mask opening of 0.33mm (13mil).
Round or square pads are permissible. Connect multi-
ple vias from the ground plane as close to the ground
pins as possible.
Install capacitors as close as possible to the IC supply
voltage pin. Place the ground end of these capacitors
near the IC GND pins to provide a low-impedance
return path for the signal current.
Prototype Chip Installation
Alignment keys on the PC board, around the area
where the chip is located, will be helpful in the proto-
type assembly process. It is better to align the chip on
the board before any other components are placed,
and then place the board on a hot plate or hot surface
until the solder starts melting. Remove the board from
the hot plate without disturbing the position of the chip
and let it cool down to room temperature before pro-
cessing the board further.
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform as well as a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP.
Performance through operating-life test and moisture
resistance remains uncompromised. The wafer-fabrica-
tion process primarily determines the performance.
Mechanical stress performance is a greater considera-
tion for UCSPs. UCSPs are attached through direct sol-
der contact to the user’s PC board, foregoing the
inherent stress relief of a packaged product lead frame.
Solder-joint contact integrity must be considered.
Comprehensive reliability tests have been performed
and are available upon request. In conclusion, the
UCSP performs reliably through environmental stresses.
Marking Information
R1
ILOAD
R2
VCC
VEE
R3
VOUT
Q1
MAX4291
Figure 11. Current Monitor for a 2-Cell Battery Stack
AAA
ORIENTATION
PRODUCT ID CODE
LOT CODE
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX4292ESA+ | 功能描述:運算放大器 - 運放 1.8V uPower Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| MAX4292ESA+T | 功能描述:運算放大器 - 運放 1.8V uPower Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| MAX4292ESA-T | 功能描述:運算放大器 - 運放 1.8V uPower Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| MAX4292EUA | 功能描述:運算放大器 - 運放 1.8V uPower Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| MAX4292EUA+ | 功能描述:運算放大器 - 運放 1.8V uPower Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
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