參數(shù)資料
型號: MAX4411ETP+T
廠商: Maxim Integrated Products
文件頁數(shù): 5/18頁
文件大?。?/td> 0K
描述: IC AMP AUDIO .08W STER AB 20TQFN
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
系列: DirectDrive®
類型: AB 類
輸出類型: 耳機(jī),2-通道(立體聲)
在某負(fù)載時最大輸出功率 x 通道數(shù)量: 80mW x 2 @ 16 歐姆
電源電壓: 1.8 V ~ 3.6 V
特點: 消除爆音,短路保護(hù)和熱保護(hù),關(guān)閉
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 20-TQFN-EP(4x4)
封裝/外殼: 20-WFQFN 裸露焊盤
包裝: 帶卷 (TR)
MAX4411
80mW, Fixed-Gain, DirectDrive, Stereo
Headphone Amplifier with Shutdown
______________________________________________________________________________________
13
output ripple. Likewise, decreasing the ESR of C2
reduces both ripple and output resistance. Lower
capacitance values can be used in systems with low
maximum output power levels. See the Output Power
vs. Charge-Pump Capacitance and Load Resistance
graph in the Typical Operating Characteristics.
Power-Supply Bypass Capacitor
The power-supply bypass capacitor (C3) lowers the out-
put impedance of the power supply, and reduces the
impact of the MAX4411’s charge-pump switching tran-
sients. Bypass PVDD with C3, the same value as C1, and
place it physically close to the PVDD and PGND pins.
Adding Volume Control
The addition of a digital potentiometer provides simple
volume control. Figure 6 shows the MAX4411 with the
MAX5408 dual log taper digital potentiometer used as
an input attenuator. Connect the high terminal of the
MAX5408 to the audio input, the low terminal to
ground, and the wiper to CIN. Setting the wiper to the
top position passes the audio signal unattenuated.
Setting the wiper to the lowest position fully attenuates
the input.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point on the PC board. Connect all components
associated with the charge pump (C2 and C3) to the
PGND plane. Connect PVDD and SVDD together at the
device. Connect PVSS and SVSS together at the
device. Bypassing of both supplies is accomplished by
charge-pump capacitors C2 and C3 (see Typical
Application Circuit). Place capacitors C2 and C3 as
close to the device as possible. Route PGND and all
traces that carry switching transients away from SGND
and the traces and components in the audio signal
path.
The QFN package features an exposed paddle that
improves thermal efficiency of the package. However,
the MAX4411 does not require additional heatsinking.
Ensure that the exposed paddle is isolated from
GND or VDD. Do not connect the exposed paddle to
GND or VDD.
When using the MAX4411 in a UCSP package, make
sure the traces to OUTR (bump C2) are wide enough to
handle the maximum expected current flow. Multiple
traces may be necessary.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, go to Maxim’s
website at www.maxim-ic.com/ucsp and look up the
Application Note: UCSP–A Wafer-Level Chip-Scale
Package.
Table 1. Suggested Capacitor Manufacturers
SUPPLIER
PHONE
FAX
WEBSITE
Taiyo Yuden
800-348-2496
847-925-0899
www.t-yuden.com
TDK
847-803-6100
847-390-4405
www.component.tdk.com
Note: Please indicate you are using the MAX4411 when contacting these component suppliers.
OUTL
MAX4411
INL
13
MAX5408
H0
L0
5
6
W0A
7
LEFT AUDIO
INPUT
15
W1A
10
CIN
RIGHT AUDIO
INPUT
INR
OUTR
11
9
H1
L1
12
11
Figure 6. MAX4411 and MAX5408 Volume Control Circuit
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