Supply Voltage (VDD
參數(shù)資料
型號: MAX44251AUA+T
廠商: Maxim Integrated Products
文件頁數(shù): 7/14頁
文件大小: 0K
描述: IC AMP LNA 20V ULT PREC UMAX
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 2,500
放大器類型: 自動調(diào)零
電路數(shù): 2
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 8 V/µs
增益帶寬積: 10MHz
電流 - 輸入偏壓: 200pA
電壓 - 輸入偏移: 3µV
電流 - 電源: 1.15mA
電流 - 輸出 / 通道: 96mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 20 V,±1.35 V ~ 10 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-uMAX
包裝: 帶卷 (TR)
2
Maxim Integrated
MAX44250/MAX44251/MAX44252
20V, Ultra-Precision, Low-Noise Op Amps
Supply Voltage (VDD to VSS).................................-0.3V to +22V
All Other Pins..................................(VSS - 0.3V) to (VDD + 0.3V)
Short-Circuit Duration to Either Supply Rail ............................ 1s
Continuous Input Current (any pin)................................. ±20mA
Differential Input Voltage...................................................... ±6V
Maximum Power Dissipation (TA = +70°C)
5-Pin SOT23 (derate 3.1mW/°C above +70°C)........246.7mW
8-Pin SOT23 (derate 9.1mW/°C above +70°C) ...........727mW
MAX (derate 4.5 mW/°C above +70°C) ....................362mW
SO (derate 8.3 mW/°C above +70°C)......................666.7mW
Operating Temperature Range........................ -40°C to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65°C to +150NC
Lead Temperature (soldering, 10s) .............................. +300NC
Soldering Temperature (reflow) .................................... +260NC
5-Pin SOT23
Junction-to-Ambient Thermal Resistance (ΘJA) .... 324.3°C/W
Junction-to-Case Thermal Resistance (ΘJC) ...............82°C/W
8-Pin SOT23
Junction-to-Ambient Thermal Resistance (ΘJA) ....... 196°C/W
Junction-to-Case Thermal Resistance (ΘJC) ...............70°C/W
MAX
Junction-to-Ambient Thermal Resistance (ΘJA) ........221°C/W
Junction-to-Case Thermal Resistance (ΘJC) ...............42°C/W
SO
Junction-to-Ambient Thermal Resistance (ΘJA) ........120°C/W
Junction-to-Case Thermal Resistance (ΘJC) ...............37°C/W
ABSOLuTE MAXIMuM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACkAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 10V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, TA = -40°C to +125°C, unless otherwise noted. Typical values are
at TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
uNITS
POWER SuPPLY
Supply Voltage Range
VDD
Guaranteed by PSRR
2.7
20
V
Power-Supply Rejection Ratio
(Note 3)
PSRR
VDD = 2.7V to 20V, VCM = 0V
140
145
dB
Quiescent Current per Amplifier
(MAX44250)
IDD
RL = J
TA = +25NC
1.22
1.7
mA
-40NC < TA < +125NC
1.85
Quiescent Current per Amplifier
(MAX44251/MAX44252)
IDD
RL = J
TA = +25NC
1.15
1.55
mA
-40NC < TA < +125NC
1.75
Power-Up Time
tON
25
F
s
DC SPECIFICATIONS
Input Common-Mode Range
VCM
Guaranteed by CMRR test
VSS -
0.05
VDD -
1.5
V
Common-Mode Rejection Ratio
(Note 3)
CMRR
TA = +25NC, VCM = -0.05V to (VDD -
1.5V)
133
140
dB
-40NC < TA < +125NC
130
Input Offset Voltage
(MAX44250) (Note 3)
VOS
TA = +25NC
3
9
F
V
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