參數(shù)資料
型號： MAX4691-MAX4694
廠商： Maxim Integrated Products, Inc.
英文描述： Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package
中文描述： 低電壓8:1復(fù)用/雙路4:1復(fù)用/三SPDT /四路SPDT包的UCSP封裝
文件頁數(shù)： 2/22頁
文件大?。?/td> 483K
代理商： MAX4691-MAX4694
M
Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/
Quad SPDT in UCSP Package
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V+ to GND..............................................................-0.3V to +12V
V+ to V- (MAX4691/MAX4692/MAX4693) ..............-0.3V to +12V
Voltage into any Terminal (Note 1)...... (V- - 0.3V) to (V+ + 0.3V)
Continuous Current into any Terminal............................. ±20mA
Peak Current W_, X_, Y_, Z_ (pulsed at 1ms,
10% duty cycle)...........................................................±40mA
ESD per Method 3015.7.......................................................>2kV
Continuous Power Dissipation (T
A
= +70
°
C)
16-Bump UCSP (derate 8.3mW/
°
C above +70
°
C) .... 659mW
16-Pin QFN (derate 18.5mW/
°
C above +70
°
C) ....... 1481mW
Note 1:
Voltages exceeding V+ or V- on any signal terminal are clamped by internal diodes. Limit forward-diode current to maxi-
mum current rating.
Note 2:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
ELECTRICAL CHARACTERISTICS
—
Single +3V Supply
(V+ = +2.7V to +3.6V, V- = 0, V
IH
= +1.4V, V
IL
= +0.4V, T
A
= -40
°
C to +85
°
C, unless otherwise noted. Typical values are at
T
A
= +25
°
C.) (Notes 3, 4, 5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Operating Temperature Range .......................... -40
°
C to +85
°
C
Storage Temperature Range............................ -65
°
C to +150
°
C
Lead Temperature (Soldering)
16-Bump UCSP (Note 2) Infrared (15s)..................... +220
°
C
Vapor Phase (60s)..................................................... +215
°
C
16-Pin QFN................................................................. +300
°
C
PARAMETER
ANALOG SWITCH
SYMBOL
CONDITIONS
T
A
MIN
TYP
MAX
UNITS
Analog Signal Range
V
W
, V
X
, V
Y
,
V
Z
,
V
W
_,
V
X
_, V
Y
_,
V
Z
_
- 40
°
C to + 85
°
C
0
V+
V
+ 25
o
C
45
70
80
On-Resistance (Note 6)
R
ON
V+ = 2.7V; I
W
, I
X
, I
Y
, I
Z
= 1mA
V
W
_, V
X
_, V
Y
_, V
Z
_ = 1.5V
- 40
°
C to + 85
°
C
+ 25
°
C
2
5
On-Resistance Match
Between Channels
(Notes 6, 7)
R
ON
V+ = 2.7V; I
W
, I
X
, I
Y
, I
Z
= 1mA
V
W
_, V
X
_, V
Y
_, V
Z
_ = 1.5V
- 40
°
C to + 85
°
C
6
+ 25
°
C
-1
1
W_, X_, Y_, Z_ Off-Leakage
Current (Note 9)
I
W
_, I
X
_,
I
Y
_, I
Z
_
V+ = 3.6V; V
W
,
V
X
, V
Y
, V
Z
= 3V,
0.6V; V
W
_, V
X
_, V
Y
_, V
Z
_ = 0.6V,
3V
- 40
°
C to + 85
°
C
-10
10
nA
+ 25
°
C
-2
2
W, X, Y, Z Off-Leakage
Current (Note 9)
I
W(OFF)
,
I
X(OFF)
,
I
Y(OFF)
,
I
Z(OFF)
V+ = 3.6V; V
W
,
V
X
, V
Y
, V
Z
= 3V,
0.6V; V
W
_, V
X
_, V
Y
_, V
Z
_ = 0.6V,
3V
- 40
°
C to + 85
°
C
-20
20
nA
+ 25
°
C
-2
2
W, X, Y, Z On-Leakage
Current (Note 9)
I
W(ON)
,
I
X(ON)
,
I
Y(ON)
,
I
Z(ON)
V+ = 3.6V; V
W
,
V
X
, V
Y
, V
Z
= 0.6V,
3V; V
W
_, V
X
_, V
Y
_, V
Z
_ = 0.6V, 3V,
or floating
- 40
°
C to + 85
°
C
-20
20
nA
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