參數(shù)資料
型號(hào): MAX9616AXA+T
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 5/12頁(yè)
文件大?。?/td> 0K
描述: IC OPAMP RRIO 2.8MHZ DUAL SC70-8
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 通用
電路數(shù): 2
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1.3 V/µs
增益帶寬積: 2.8MHz
電流 - 輸入偏壓: 1pA
電壓 - 輸入偏移: 17µV
電流 - 電源: 170µA
電流 - 輸出 / 通道: 275mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: SC-70-8
供應(yīng)商設(shè)備封裝: SC-70-8
包裝: 帶卷 (TR)
其它名稱: MAX9616AXA+TTR
2 ______________________________________________________________________________________
MAX9614/MAX9616
Low-Power Single/Dual, Rail-to-Rail Op Amps
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
IN+, IN-, SHDN, VCC to GND..................................-0.3V to +6V
OUT to GND................................................-0.3V to VCC + 0.3V
Short-Circuit (GND) Duration, OUT, OUTA, OUTB ................. 5s
Continuous Input Current (any pin)................................. Q20mA
Thermal Limits (Note 1) Multilayer PCB
Continuous Power Dissipation (TA = +70NC)
6-Pin SC70 (derate 3.1mW/NC above +70NC).............245mW
B
JA.......................................................................326.5NC/W
B
JC..........................................................................115NC/W
8-Pin SC70 (derate 3.1mW/NC above +70NC).............245mW
B
JA
..........................................................................326NC/W
B
JC..........................................................................115NC/W
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+240NC
ELECTRICAL CHARACTERISTICS
(VCC = VSHDN = 3.3V, VIN+ = VIN- = VCM = GND, RL = 10kI to VCC/2, TA = -40NC to +125NC. Typical values are at TA = +25NC,
unless otherwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Input Voltage Range
VIN+, VIN- Guaranteed by CMRR test
-0.1
VCC
- 1.4
V
Input Offset Voltage
VOS
TA = +25NC
17
100
F
V
TA = -40NC to +125NC, after power-up
autocalibration
165
TA = -40NC to +125NC
750
Input Offset Voltage Drift
VOS - TC
1
7.5
F
V/NC
Input Bias Current (Note 3)
IB
TA = -40NC to +25°C
1
1.55
pA
TA = +70NC
45
TA = +85NC
135
TA = +125NC
1.55
nA
Input Offset Current (Note 3)
IOS
TA = -40NC to +25°C
0.5
pA
TA = +70NC
7
TA = +85NC
25
TA = +125NC
4000
Common-Mode Rejection Ratio
CMRR
VCM = -0.1V to VCC - 1.4V, TA = +25NC
80
95
dB
VCM = -0.1V to VCC - 1.4V, TA = -40NC to
+125NC
78
Open-Loop Gain
AOL
+0.4V P VOUT P VCC - 0.4V, RL = 10kI
99
115
dB
+0.4V P VOUT P VCC - 0.4V, RL = 600I
93
110
Output Short-Circuit Current
(Note 4)
ISC
To VCC
275
mA
To GND
75
Output Voltage Low
VOL
RL = 10kI
1
11
mV
RL = 600I
11
100
RL = 32I
170
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