3V Video Amplifier with
Internal Gain and Filter in SC70
MAX9680
2 ______________________________________________________________________________________
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Supply Voltage (VDD to GND).................................-0.3V to +4V
ENABLE to GND......................................................-0.3V to +4V
IN to GND................................................. -0.3V to (VDD + 0.3V)
OUT to GND (ENABLE is high)................ -0.3V to (VDD + 0.3V)
OUT to GND (ENABLE is low) .............................-0.3V to +3.2V
ENABLE, IN ..................................................................... Q50mA
OUT ...........................................................................Continuous
Electrostatic Discharge
Human Body Model.......................................................2000V
Charged Device Model ...................................................500V
Continuous Power Dissipation (TA = +70NC)
6-Pin SC70 (derate 3.1mW/C above +70NC) .............245mW
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VDD = VENABLE = 2.8V, VGND = 0V, RL = 150I to GND. TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SC70
Junction-to-Ambient Thermal Resistance (
qJA) .....326.5°C/W
Junction-to-Case Thermal Resistance (
qJC) .............115°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
OFFSET LEVEL-SHIFT VOLTAGE
Output Level-Shift Voltage
VOLS
VIN = VGND
0
120
250
mV
Power-Supply Rejection Ratio
PSRR
VIN = VGND, VDD = 2.7V to 3.6V
200
F
V/V
INPUT VOLTAGE RANGE
Input Voltage Range
VCM
VDD = 2.7V
VGND
0.445
V
VDD = 2.8V
VGND
0.464
Input Resistance (In+)
RIN
VIN = 0.5V
732
872
1012
I
RSET Resistance
RSET
VRSET = 0.5V
3150
3750
4350
I
RSET/RIN Ratio
4.214
4.3
4.386
VOLTAGE GAIN
DC Voltage Gain (Note 3)
AV
VDD = 2.7V, VIN = VGND to 0.445V
5.00
5.17
5.34
V/V
VDD = 2.8V, VIN = VGND to 0.464V
5.00
5.17
5.34
FREQUENCY RESPONSE
Filter Response
VIN = VGND to
0.387V
f = 4.5MHz
-0.2
dB
f = 9MHz
-3.5
f = 27MHz
-23
f = 54MHz
-45
Differential Gain Error
Five-step modulated staircase of 127.8mV
step size and 305.3mV peak-to-peak
subcarrier amplitude, f = 4.43MHz
0.2
%
Differential Phase Error
Five-step modulated staircase of 127.8mV
step size and 305.3mV peak-to-peak
subcarrier amplitude, f = 4.43MHz
0.3
degrees