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參數(shù)資料
| 型號： | MAX9934TALT+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/19頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP CURR SENSE LV 6UDFN |
| 標準包裝： | 2,500 |
| 放大器類型： | 電流檢測 |
| 電路數(shù)： | 1 |
| -3db帶寬： | 1.5kHz |
| 電流 - 輸入偏壓： | 35µA |
| 電壓 - 輸入偏移： | 10µV |
| 電流 - 電源： | 120µA |
| 電壓 - 電源，單路/雙路(±)： | 2.5 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-WFBGA，CSPBGA |
| 供應商設備封裝： | 6-uCSP（1.57x1.16） |
| 包裝： | 帶卷 (TR) |
MAX9934
High-Precision, Low-Voltage, Current-Sense Amplifier
with Current Output and Chip Select for Multiplexing
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = 3.3V, VRS+ = VRS- = 3.0V, VSENSE = 0V, VCM = (VRS+ + VRS-)/2, VCS = 3.3V, ROUT = 10k to GND for unidirectional opera-
tion, ROUT = 10k to VCC/2 for bidirectional operation. TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA =
+25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
RS+, RS- to GND......................................................-0.3V to +6V
VCC to GND ..............................................................-0.3V to +4V
CS, OUT to GND (VCC = 0, or CS < VIL)..................-0.3V to +4V
OUT to GND (CS > VIH)................................-0.3V to VCC + 0.3V
Differential Input Voltage (RS+ - RS-) ....................................±6V
Output Short-Circuit Current Duration
OUT to GND or VCC ...............................................Continuous
Continuous Input Current into Any Terminal.....................±20mA
Continuous Power Dissipation (TA = +70°C)
8-Pin MAX (derate multilayer 4.8mW/°C
above +70°C).............................................................388mW
Junction-to-Ambient Thermal Resistance (
θJA)
(Note 1) ....................................................................206°C/W
Junction-to-Case Thermal Resistance (
θJC)
(Note 1) ......................................................................42°C/W
6-Bump UCSP (derate multilayer 3.9mW/°C
above +70°C).............................................................308mW
Junction-to-Ambient Thermal Resistance (
θJA)
(Note 1) ....................................................................260°C/W
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (MAX only, soldering, 10s) ..............+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
TA = +25°C
±10
MAX9934T
-40°C
≤ TA ≤ +125°C
±14
TA = +25°C
±10
Input Offset Voltage (Note 3)
VOS
MAX9934F
-40°C
≤ TA ≤ +125°C
±20
V
MAX9934T
±60
Input Offset Voltage Drift (Note 3)
VOS/dT
MAX9934F
±90
nV/°C
Common-Mode Input Voltage
Range (Average of VRS+ and
VRS-) (Note 3)
CMVR
Guaranteed by CMRR2
-0.1
+5.5
V
TA = +25°C
128
134
0
≤ VCM ≤ VCC -
0.2V (MAX9934F)
-40°C
≤ TA ≤ +125°C
112
TA = +25°C
128
135
CMRR1
0
≤ VCM ≤ VCC -
0.2V (MAX9934T)
-40°C
≤ TA ≤ +125°C
109
TA = +25°C
119
125
-0.1
≤ VCM ≤ 5.5V
(MAX9934F)
-40°C
≤ TA ≤ +125°C
104
TA = +25°C
98
113
Common-Mode Rejection Ratio
(Note 3)
CMRR2
-0.1
≤ VCM ≤ 5.5V
(MAX9934T)
-40°C
≤ TA ≤ +125°C
98
dB
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
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