參數(shù)資料
型號(hào): MB95F564HWQN-G-JNERE1
元件分類: 微控制器/微處理器
英文描述: 8-BIT, FLASH, 16.25 MHz, MICROCONTROLLER, PQCC32
封裝: 5 X 5 MM, 0.80 MM HEIGHT, PLASTIC, QFN-32
文件頁(yè)數(shù): 76/84頁(yè)
文件大?。?/td> 3941K
代理商: MB95F564HWQN-G-JNERE1
MB95560H/570H/580H Series
78
DS702-00010-2v0-E
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
20-pin plastic SOP
Lead pitch
1.27 mm
Package width
×
package length
7.50 mm
× 12.70 mm
Lead shape
Gullwing
Lead bend
direction
Normal bend
Sealing method
Plastic mold
Mounting height
2.65 mm Max
20-pin plastic SOP
(FPT-20P-M09)
C
2008-2010 FUJITSU SEMICONDUCTOR LIMITED F20030S-c-1-2
Details of "A" part
INDEX
0.10(.004)
(.008±.004)
0.20±0.10
.007
+.005
.099
0.17
+0.13
2.52
(Mounting height)
0~8°
(Stand off)
0.80
+0.47
0.30
.031
+.019
.012
"A"
.001
+.003
.010
0.25
+0.07
0.02
#12.70±0.10(.500±.004)
11
20
1.27(.050)
1
10
0.25(.010) M
0.05
+0.09
0.40
.016
+.004
.002
#7.50±0.10
(.295±.004)
0.20
+0.40
10.2
.402
+.016
.008
BTM E-MARK
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) # : These dimensions do not include resin protrusion.
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相關(guān)代理商/技術(shù)參數(shù)
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