參數(shù)資料
型號: MB95F582HWQN-G-JNE1
元件分類: 微控制器/微處理器
英文描述: 8-BIT, FLASH, 16.25 MHz, MICROCONTROLLER, PQCC32
封裝: 5 X 5 MM, 0.80 MM HEIGHT, PLASTIC, QFN-32
文件頁數(shù): 80/84頁
文件大?。?/td> 3941K
代理商: MB95F582HWQN-G-JNE1
MB95560H/570H/580H Series
DS702-00010-2v0-E
81
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
16-pin plastic SOP
Lead pitch
1.27 mm
Package width
×
package length
3.90 mm
× 9.96 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.75 mm MAX
Weight
0.12 g
16-pin plastic SOP
(FPT-16P-M23)
C
2010 FUJITSU SEMICONDUCTOR LIMITED HMbF16-23Sc-1-1
#9.96±0.10(.392±.004)
#3.90±0.10 6.00±0.20
(.236±.008)
(.154±.004)
0.10(.004)
1.27(.050)
0.40
(.016
)
1
16
M
0.25(.010)
7
INDEX
.024
0.60
+0.08
–0.06
+0.20
–0.15
8
9
BTM E-MARK
+0.11
–0.04
+.004
–.002
(.026±.004)
0.65±0.10
.006
0.15
+0.04
–0.02
+0.10
–0.05
(.057±.008)
1.45±0.20
.063
1.60
+0.06
–0.10
+0.15
–0.25
± 2
7 ± 2
8 ± 2
(.016±.004)
0.40±0.10
(.016±.004)
0.40±0.10
8 ± 2
(1.04 (.041))
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) #: These dimensions do not include resin protrusion.
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