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參數(shù)資料
| 型號： | MB96F326AWBPMC-GSE2 |
| 廠商： | FUJITSU LTD |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 16-BIT, FLASH, 56 MHz, MICROCONTROLLER, PQFP80 |
| 封裝： | 12 X 12 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-80 |
| 文件頁數(shù)： | 53/100頁 |
| 文件大?。?/td> | 2162K |
| 代理商： | MB96F326AWBPMC-GSE2 |
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MB96320 Series
56
DS07-13804-2E
*1: AVCC and VCC must be set to the same voltage. It is required that AVCC does not exceed VCC and that the voltage
at the analog inputs does not exceed AVCC neither when the power is switched on.
*2: VI and VO should not exceed VCC + 0.3 V. VI should also not exceed the specified ratings. However if the maximum
current to/from a input is limited by some means with external components, the ICLAMP rating supersedes the VI
rating. Input/output voltages of standard ports depend on VCC.
*3:
Applicable to all general purpose I/O pins (Pnn_m)
Use within recommended operating conditions.
Use at DC voltage (current)
The +B signal should always be applied a limiting resistance placed between the +B signal and the
microcontroller.
The value of the limiting resistance should be set so that when the +B signal is applied the input current to
the microcontroller pin does not exceed rated values, either instantaneously or for prolonged periods.
Note that when the microcontroller drive current is low, such as in the power saving modes, the +B input
potential may pass through the protective diode and increase the potential at the VCC pin, and this may affect
other devices.
Note that if a +B signal is input when the microcontroller power supply is off (not fixed at 0 V), the power
supply is provided from the pins, so that incomplete operation may result.
Note that if the +B input is applied during power-on, the power supply is provided from the pins and the resulting
supply voltage may not be sufficient to operate the Power reset (except devices with persistent low voltage
reset in internal vector mode).
Sample recommended circuits:
*4: The maximum permitted power dissipation depends on the ambient temperature, the air flow velocity and the
thermal conductance of the package on the PCB.
The actual power dissipation depends on the customer application and can be calculated as follows:
PD = PIO + PINT
PIO =
∑ (VOL * IOL + VOH * IOH) (IO load power dissipation, sum is performed on all IO ports)
PINT = VCC * (ICC + IA) (internal power dissipation)
ICC is the total core current consumption into VCC as described in the “DC characteristics” and depends on the
selected operation mode and clock frequency and the usage of functions like Flash programming or the clock
modulator.
IA is the analog current consumption into AVCC.
*5: Worst case value for a package mounted on single layer PCB at specified TA without air flow.
*6: Please contact Fujitsu for reliability limitations when using under these conditions.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed any of these ratings.
P-ch
N-ch
VCC
R
Protective Diode
Limiting
resistance
+B input (0V to 16V)
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