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參數(shù)資料
| 型號： | MBRB2060CTT4 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | 10 A, 60 V, SILICON, RECTIFIER DIODE |
| 文件頁數(shù)： | 3/6頁 |
| 文件大小： | 105K |
| 代理商： | MBRB2060CTT4 |
MBRB2060CT
3
Rectifier Device Data
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
mm
inches
0.74
18.79
0.065
1.651
0.07
1.78
0.14
3.56
0.330
8.38
0.420
10.66
D2PAK POWER DISSIPATION
The power dissipation of the D2PAK is a function of the drain
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined by
TJ(max), the maximum rated junction temperature of the die,
R
θJA, the thermal resistance from the device junction to
ambient; and the operating temperature, TA. Using the values
provided on the data sheet for the D2PAK package, PD can be
calculated as follows:
PD =
TJ(max) – TA
R
θJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this case
is 2.5 watts.
PD =
150
°C – 25°C
50
°C/W
= 2.5 watts
The 50
°C/W for the D2PAK package assumes the use of the
recommended footprint on a glass epoxy printed circuit board
to achieve a power dissipation of 2.5 watts. There are other
alternatives to achieving higher power dissipation from the
D2PAK package. One is to increase the area of the drain pad.
By increasing the area of the drain pad, the power dissipation
can be increased. Although one can almost double the power
dissipation with this method, one will be giving up area on the
printed circuit board which can defeat the purpose of using
surface mount technology.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad
. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
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| MBRB30H60CT-E3/31 | 15 A, 60 V, SILICON, RECTIFIER DIODE, TO-263AB |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MBRB2060CTT4G | 功能描述:肖特基二極管與整流器 20A 60V RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| MBRB2060CT-TP | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICRO COMMERCIAL COMPONENTS 20736 MARILLA STREET CHATSWORTH |
| MBRB2060CTTR | 功能描述:DIODE ARRAY SCHOTTKY 60V D2PAK 制造商:smc diode solutions 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 二極管配置:1 對共陰極 二極管類型:肖特基 電壓 - DC 反向（Vr）（最大值）:60V 電流 - 平均整流（Io）（每二極管）:- 不同 If 時的電壓 - 正向（Vf）:800mV @ 10A 速度:快速恢復 = 200mA（Io） 反向恢復時間（trr）:- 不同?Vr 時的電流 - 反向漏電流:1mA @ 60V 安裝類型:表面貼裝 封裝/外殼:TO-263-3，D2Pak（2 引線+接片），TO-263AB 供應商器件封裝:D2PAK 標準包裝:1 |
| MBRB2070CT | 制造商:BILIN 制造商全稱:Galaxy Semi-Conductor Holdings Limited 功能描述:DUAL SCHOTTKY RECTIFIERS |
| MBRB2080 | 制造商:IRF 制造商全稱:International Rectifier 功能描述:SCHOTTKY RECTIFIER 20 Amp |
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