MC10EL32 MC100EL32
3–3
MOTOROLA
ECLinPS and ECLinPS Lite
DL140 — Rev 3
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE P
SEATING
1
4
5
8
C
K
4
A
0.25 (0.010)
M
T B
S
S
0
B
M
8X
D
R
M
J
X
F
–A–
–B–
–T–
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
4.80
3.80
1.35
0.35
0.40
1.27 BSC
0.18
0.10
0
5.80
0.25
MAX
5.00
4.00
1.75
0.49
1.25
MILLIMETERS
0.25
0.25
7
6.20
0.50
G
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
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data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
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MC10EL32/D