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參數(shù)資料
| 型號(hào)： | MC100EL52DTR2G |
| 廠商： | ON Semiconductor |
| 文件頁(yè)數(shù)： | 2/9頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FLIP FLOP CLK D DIFF 8-TSSOP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | 100EL |
| 功能： | 標(biāo)準(zhǔn) |
| 類型： | D 型 |
| 輸出類型： | 差分 |
| 元件數(shù)： | 1 |
| 每個(gè)元件的位元數(shù)： | 1 |
| 頻率 - 時(shí)鐘： | 2.8GHz |
| 延遲時(shí)間 - 傳輸： | 365ps |
| 觸發(fā)器類型： | 正邊沿 |
| 電源電壓： | 4.2 V ~ 5.7 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-TSSOP，8-MSOP（0.118"，3.00mm 寬） |
| 包裝： | 帶卷 (TR) |
MC10EL52, MC100EL52
http://onsemi.com
2
Figure 1. Logic Diagram and Pinout Assignment
1
2
3
45
6
7
8
Q
VEE
VCC
D
Q
CLK
D
Table 1. TRUTH TABLE
D*
L
H
CLK*
Z
Q
L
H
Z = LOW to HIGH Transition
D, D
ECL Data Input
CLK, CLK
ECL Clock Input
Q, Q
ECL Data Output
VCC
Positive Supply
VEE
Negative Supply
Table 2. PIN DESCRIPTION
PIN
FUNCTION
* Pin will default low when left open.
EP
(DFN8 only) Thermal exposed
pad must be connected to a suf-
ficient thermal conduit. Electric-
ally connect to the most negative
supply (GND) or leave uncon-
nected, floating open.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI VCC
VI VEE
6
V
Iout
Output Current
Continuous
Surge
50
100
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
8 SOIC
190
130
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
8 SOIC
41 to 44
°C/W
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
8 TSSOP
185
140
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
8 TSSOP
41 to 44 ± 5%
°C/W
Tsol
Wave Solder
Pb
PbFree
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
°C
qJC
Thermal Resistance (JunctiontoCase)
(Note 1)
DFN8
35 to 40
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board 2S2P (2 signal, 2 power)
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