參數(shù)資料
型號(hào): MC100EP56MNTXG
廠商: ON Semiconductor
文件頁(yè)數(shù): 5/11頁(yè)
文件大?。?/td> 0K
描述: IC MUX ECL DUAL DIFF 2:1 20-QFN
標(biāo)準(zhǔn)包裝: 3,000
系列: 100EP
類型: 差分?jǐn)?shù)字多路復(fù)用器
電路: 2 x 2:1
獨(dú)立電路: 1
電壓電源: 雙電源
電源電壓: 3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 20-QFN(4x4)
包裝: 帶卷 (TR)
MC10EP56, MC100EP56
http://onsemi.com
3
Table 3. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 150 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb Pkg
PbFree Pkg
SOIC
TSSOP
QFN
Level 1
N/A
Level 3
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
Transistor Count
140 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI VCC
VI VEE
6
V
Iout
Output Current
Continuous
Surge
50
100
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
20 TSSOP
140
100
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
20 TSSOP
23 to 41
°C/W
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
20 SOIC
90
60
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
20 SOIC
33 to 35
°C/W
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
QFN20
47
33
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
QFN20
18
°C/W
Tsol
Wave Solder
Pb
PbFree
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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