MC100LVEL39
http://onsemi.com
4
Table 5. LVNECL DC CHARACTERISTICS
V
CC
= 0.0 V; V
EE
=
3.3 V (Note 4)
40
°
C
25
°
C
85
°
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
I
EE
Power Supply Current
50
59
50
59
54
61
mA
V
OH
Output HIGH Voltage (Note 5)
1085
1005
880
1025
955
880
1025
955
880
mV
V
OL
Output LOW Voltage (Note 5)
1830
1695
1555
1810
1705
1620
1810
1705
1620
mV
V
IH
Input HIGH Voltage (Single
Ended)
1165
880
1165
880
1165
880
mV
V
IL
Input LOW Voltage (Single
Ended)
1810
1475
1810
1475
1810
1475
mV
V
BB
Output Voltage Reference
1.38
1.26
1.38
1.26
1.38
1.26
V
V
IHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 6)
V
PP
< 500 mV
V
PP
500 mV
2.0
1.8
0.4
0.4
2.1
1.9
0.4
0.4
2.1
1.9
0.4
0.4
V
V
I
IH
Input HIGH Current
150
150
150
A
I
IL
Input LOW Current
0.5
0.5
0.5
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary
±
0.3 V.
5. Outputs are terminated through a 50 resistor to V
CC
2.0 V.
6. V
IHCMR
min varies 1:1 with V
EE
, max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential input signal.
Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between V
PP
min and 1.0 V.
Table 6. AC CHARACTERISTICS
V
CC
= 3.3 V; V
EE
= 0.0 V or V
CC
= 0.0 V; V
EE
=
3.3 V (Note 7)
40
°
C
25
°
C
85
°
C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
fmax
Maximum Toggle Frequency
1000
1000
1000
MHz
t
PLH
t
PHL
Propagation Delayed Output
CLK to Q (Diff)
CLK to Q (S.E.)
MR to Q
850
850
600
1150
1150
900
900
900
610
1200
1200
910
950
950
630
1250
1250
930
ps
t
SKEW
Within-Device Skew (Note 8)
Part-to-Part
Q
0
Q
3
Q
0
Q
3
(Diff)
50
200
50
200
50
200
ps
tJITTER
Random CLOCK Jitter (RMS) @
1000 MHz
2.0
3.0
2.0
3.0
2.0
3.0
ps
t
S
Setup Time
EN to CLK
DIVSEL to CLK
250
400
250
400
250
400
ps
t
H
Hold Time
CLK to EN
CLK to Div_Sel
100
150
100
150
100
150
ps
V
PP
Input Swing (Note 9)
CLK
250
1000
250
1000
250
1000
mV
t
RR
Reset Recovery Time
100
100
100
ps
t
PW
Minimum Pulse Width
CLK
MR
500
700
500
700
500
700
ps
t
r
, t
f
Output Rise/Fall Times Q (20%
80%)
280
550
280
550
280
550
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. V
EE
can vary
±
0.3 V. Outputs are terminated through a 50 resistor to V
CC
2.0 V.
8. Skew is measured between outputs under identical transitions.
9. V
(min) is minimum input swing for which AC parameters are guaranteed. The device will function reliably with differential inputs down
to 100 mV.