
Semiconductor Components Industries, LLC, 2005
November, 2005 Rev. 7
1
Publication Order Number:
MC10E1652/D
MC10E1652
5V, 5V ECL Dual ECL Output
Comparator with Latch
The MC10E1652 is fabricated using ON Semiconductor’s advanced
MOSAIC III process and is output compatible with 10H logic
devices. In addition, the device is available in both a 16-pin DIP and a
20-pin surface mount package. However, the MC10E1652 provides
user programmable hysteresis.
The latch enable (LEN
a
and LEN
b
) input pins operate from standard
ECL 10H logic levels. When the latch enable is at a logic high level,
the MC10E1652 acts as a comparator; hence, Q will be at a logic high
level if V1 > V2 (V1 is more positive than V2). Q is the complement
of Q. When the latch enable input goes to a low logic level, the outputs
are latched in their present state, providing the latch enable setup and
hold time constraints are met. The level of input hysteresis is
controlled by applying a bias voltage to the HYS pin.
Features
Typical 3.0 dB Bandwidth > 1.0 GHz
Typical V to Q Propagation Delay of 775 ps
Typical Output Rise/Fall of 350 ps
Common Mode Range 2.0 V to +3.0 V
Individual Latch Enables
Differential Outputs
Operating Mode: V
CC
=
5.0 V, V
EE
= 5.2 V, GND = 0 V
Programmable Input Hysteresis
No Internal Input Pulldown Resistors
ESD Protection: > 2 KV HBM, > 100 V MM
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL94 code V0 @ 1/8”,
Oxygen Index 28 to 34
Transistor Count = 85 devices
PbFree Packages are Available*
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
MARKING
DIAGRAMS
1
16
CDIP16
L SUFFIX
CASE 620A
MC10E1652L
AWLYYWW
PLCC20
FN SUFFIX
CASE 775
201
MC10E1652G
AWLYYWW
1 20
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= PbFree Package
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION