MC145483
PACKAGE DIMENSIONS
DW SUFFIX
SOG PACKAGE
CASE 751D–04
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25)
B S
T
D
20X
M
B
M
0.010 (0.25)
P
10X
J
F
G
18X
K
C
–T– SEATING
PLANE
M
R X 45
_
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
12.65
12.95
0.499
0.510
B
7.40
7.60
0.292
0.299
C
2.35
2.65
0.093
0.104
D
0.35
0.49
0.014
0.019
F
0.50
0.90
0.020
0.035
G
1.27 BSC
0.050 BSC
J
0.25
0.32
0.010
0.012
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
10.05
10.55
0.395
0.415
R
0.25
0.75
0.010
0.029
__
SD SUFFIX
SSOP
CASE 940C–02
20
11
10
1
H
A
B
–P–
–R–
NOTES:
1.
CONTROLLING DIMENSION: MILLIMETER.
2.
DIMENSIONS AND TOLERANCES PER ANSI
Y14.5M, 1982.
3.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD
FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.15MM PER SIDE.
4.
DIMENSION IS THE LENGTH OF TERMINAL
FOR SOLDERING TO A SUBSTRATE.
5.
TERMINAL POSITIONS ARE SHOWN FOR
REFERENCE ONLY.
6.
THE LEAD WIDTH DIMENSION DOES NOT
INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL
BE 0.08MM TOTAL IN EXCESS OF THE LEAD
WIDTH DIMENSION.
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
7.10
7.30
0.280
0.287
B
5.20
5.38
0.205
0.212
C
1.75
1.99
0.069
0.078
D
0.25
0.38
0.010
0.015
F
0.65
1.00
0.026
0.039
G
0.65 BSC
0.026 BSC
H
0.59
0.75
0.023
0.030
J
0.10
0.20
0.004
0.008
L
7.65
7.90
0.301
0.311
M
0
8
0
8
N
0.05
0.21
0.002
0.008
__
_
G
D
S
P
M
0.120 (0.005)
T
0.076 (0.003)
N
C
M
R
M
0.25 (0.010)
L
J
F
M
NOTE 4
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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